IRIS Institutional Research Information System

Giacomozzi, Flavio
 Distribuzione geografica
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Continente #
NA - Nord America 8.285
EU - Europa 4.614
AS - Asia 1.394
Continente sconosciuto - Info sul continente non disponibili 64
SA - Sud America 30
OC - Oceania 22
AF - Africa 8
Totale 14.417
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Nazione #
US - Stati Uniti d'America 8.177
DE - Germania 1.044
SE - Svezia 886
UA - Ucraina 878
FI - Finlandia 578
HK - Hong Kong 385
IT - Italia 354
VN - Vietnam 294
CN - Cina 289
IE - Irlanda 266
GB - Regno Unito 245
IN - India 207
RU - Federazione Russa 132
CA - Canada 78
BE - Belgio 77
EU - Europa 64
FR - Francia 52
IR - Iran 43
SG - Singapore 41
KR - Corea 33
TW - Taiwan 32
NL - Olanda 31
MX - Messico 30
IL - Israele 23
JP - Giappone 14
ES - Italia 13
NZ - Nuova Zelanda 13
PT - Portogallo 12
EC - Ecuador 10
AU - Australia 9
CH - Svizzera 9
ID - Indonesia 9
PE - Perù 9
PH - Filippine 9
PL - Polonia 7
CO - Colombia 6
GR - Grecia 6
HU - Ungheria 6
TR - Turchia 6
AT - Austria 5
BR - Brasile 4
MY - Malesia 4
RO - Romania 4
PK - Pakistan 3
CZ - Repubblica Ceca 2
EG - Egitto 2
LV - Lettonia 2
RS - Serbia 2
ZA - Sudafrica 2
AE - Emirati Arabi Uniti 1
AR - Argentina 1
DZ - Algeria 1
IQ - Iraq 1
MZ - Mozambico 1
NG - Nigeria 1
NO - Norvegia 1
SC - Seychelles 1
SI - Slovenia 1
SK - Slovacchia (Repubblica Slovacca) 1
Totale 14.417
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Città #
Jacksonville 1.834
Chandler 1.823
Wilmington 516
Ashburn 428
Hong Kong 378
Helsinki 330
Dong Ket 294
Ann Arbor 284
Boardman 278
Kronberg 272
Dublin 266
Dearborn 233
Woodbridge 224
Trento 159
Seattle 120
Beijing 119
Houston 101
Phoenix 86
Pune 86
Brooklyn 74
New York 74
Brussels 73
Redwood City 70
Shanghai 55
Mountain View 46
Los Angeles 34
Singapore 33
Munich 30
Norwalk 27
Portsmouth 26
Montréal 25
Tappahannock 23
Mcallen 22
Monmouth Junction 22
Toronto 22
Hanover 20
Portland 19
Ardabil 18
Augusta 17
Falkenstein 17
Leawood 17
Auburn Hills 15
Guangzhou 15
New Taipei 14
San Mateo 14
Centrale 13
Redmond 13
Secaucus 13
Hefei 12
Milan 12
Rome 12
Saint Petersburg 11
Falls Church 10
Gunzenhausen 10
Taipei 10
City of Muntinlupa 9
Meppel 9
Wuhan 9
Des Moines 8
Glasgow 8
Jakarta 8
Melbourne 8
Montreal 8
Mumbai 8
Nanjing 8
Eindhoven 7
Kunming 7
Lausanne 7
Lima 7
Ottawa 7
Vicenza 7
Budapest 6
Cologne 6
Hangzhou 6
St Petersburg 6
Zanjan 6
Athens 5
Barcelona 5
Bethesda 5
Florence 5
Jinan 5
Longueuil 5
Southampton 5
Southend 5
Tokyo 5
Zhengzhou 5
Altena 4
Andover 4
Bari 4
Chennai 4
Costa Mesa 4
Minneapolis 4
Nanchang 4
North Bergen 4
Padova 4
Pereira 4
Rovereto 4
San Jose 4
São Luís 4
Washington 4
Totale 9.030
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Nome #
Assessment of ORDYL SY 355 dry film for RF MEMS 0-level packaging 191
Modeling and characterization of a circular-shaped energy scavenger in MEMS surface micromachining technology 160
A low contact-resistance winged-bridge RF-MEMS series switch for wide-band applications 105
Conductive through silicon via holes for RF applications 99
Cr/Ni/Au multilayer films for high temperature MEMS applications 92
RF MEMS Switches: Micro Dispositivos Ítalo-Argentinos para Radiofrecuencia con Aplicaciones Espaciales 90
Wafer resistivity influence over DRIE processes for TSVs manufacturing 88
Packaged Single Pole Double Thru (SPDT) and True Time Delay Lines (TTDL) Based on RF MEMS Switches 87
Progettazione, disegno, fabbricazione e caratterizzazione di un microfono capacitivo in silicio con tecnologie MEMS 86
Filtro paso-banda con control preciso de frecuencia central y ancho de banda usando interruptores RF MEMS 84
A Flexible Fabrication Process for RF MEMS Devices 83
Diseño de dispositivos micro-conmutadores RF-MEMS capacitivos con metalizacion flotante 82
Single-Pole Double-Thru and True Time Delay Lines in Alumina Packaging Based on RF MEMS Switches in Silicon Technology 82
Design and Realization of a MEMS Tunable Reflectarray for mm-wave Imaging Application 82
Progettazione e fabbricazione di sensori amperometrici impiantabili per il monitoraggio del lattato nel muscolo 79
Low Spring Constant RF Mems Capacitive Switches, Technology and Characterization 77
OPTIMIZED DRIE PROCESS FOR TAPERED WALLS THROUGH WAFER VIA HOLES MANUFACTURING 77
On-wafer electro-mechanical characterization of silicon MEMS switches 76
A General Purpose Reconfigurable MEMS-Based Attenuator for Radio Frequency and Microwave Applications 76
Characterization of Silicon Anisotropic TMAH Etch for Bulk Micromachining 75
Microstructures etched in doped TMAH solutions 75
Measurements of the mechanical properties of composite membranes by load-deflection method with a profilometer 74
A Micromachined Angled Hall Magnetic Field Sensor Using Novel In-Cavity Patterning 74
A micromachined gold palladium Kelvin probe for hydrogen sensing 74
RF-MEMS switch design optimization for long-term reliability 73
3D Micromachined Ka (30 GHz) Band RF MEMS Filter for On-Board Satellite Communication Systems 73
Smart Vision Chips in CCD and CCD/CMOS Technologies 72
Conmutadores RF-MEMS de baja tensión 72
3D Micromachined Ka (30 GHz) Band RF MEMS Filter for On-Board Satellite Communication Systems 72
Fabrication of Through-Wafer Interconnections by Gold Electroplating 72
Technological and design improvements for RF MEMS shunt switsches 71
Stress Characterization of Silicon Oxide, Silicon Nitride, Chromium and Gold Films for Micromechanics 71
Stress Characterization of Silicon Oxide, Silicon Nitride, Chromium and Gold Films for Micromechanics 70
Electromechanical aspects in the optimization of the trasmission characteristics of series ohmic RF-switches 70
A microelectrode array fabrication technology for electrophysiological measurements 69
Combined Liquid Crystal and MEMS Phase Shifter: Preliminary Measurement Results 69
MEMS packaging by using dry film resist2015 XVIII AISEM Annual Conference 69
A Microfabricated Device for Specific Target Recognition in vivo for Cancer Diagnostic 69
MEMS-based LC tank with extended tuning range for low phase-noise VCO 69
A Silicon Based MEMS Technology for Electro-statically Actuated SPDT RF Switches 68
Development of silicon microheaters for chemoresistive gas sensors 68
Un processo ISFET/CMOS compatibile con un modulo aggiuntivo per microelettrodi progettato per la costruzione di matrici di ISFET e matrici di ISFET/microelettrodi con elettronica di preelaborazione 68
New Deep Reactive Ion Etching process for through wafer via manufacturing 68
A highly-repeatable, broadband 180º phase switch for integrated MEMS processes 68
Physical properties of TiN thin films 68
Characterization of Dynamics in RF-MEMS Switches 67
Design and Realization of a MEMS Tunable Reflectarray for mm-Wave Imaging Application 67
MEMSWAVE 2009, Proceedings of the 10th international Symposium on RF MEMS and RF Microsystems 67
V-shape through wafer via manufactured by drie variable isotropy process 67
STUDY OF AN ELECTRO-MECHANIC MECHANISM EXPLOITING IN-PLANE ROTATION FOR THE REALIZATION OF TUNEABLE CAPACITORS 67
MEMS Technology for RF Switches 66
Seeman-Bohlin x-ray diffraction study of Al-1%Si thin films used in ULSI devices 66
Characterization of MIM Capacitors for the Investigation of RF MEMS Switch Charging Effects 66
Microwave and Millimeter Wave MEMS 66
K-band RF-MEMS uniplanar reconfigurable-bandwidth bandpass filter using multimodal immittance inverters 66
Design and manufacturing of X-Band tunable microcavity resonator in MEMS technology 66
Charging Effects and related Equivalent Circuits for Ohmic Series and Shunt CapacitiveRF MEMS switches 65
Long-term reliability of RF-MEMS dielectric-less capacitive switches 65
An equivalent-circuit model for shunt-connected coplanar microelectromechanical system switches for high frequency applications 65
Development of High Con Coff Ratio RF MEMS Shunt Switches 64
Electrochemical effects during anisotropic bulk-silicon etching with doped and undoped TMAHW solutions 64
Piston-type condenser microphone with structured polysilicon 64
Thick and homogeneous surface layers obtained by reactive ion-beam-enhanced deposition 64
Fabrication of silicon bolometers with bulk micromachining technology 64
Anemometric air flow sensor on Silicon membrane 63
Resistive pressure sensing structures on polymide membranes on GaAs substrate 63
Electromechanical characterization of low actuation voltage RF MEMS capacitive switches based on DC CV measurements 63
Controlling stress and stress gradient during the release process in gold suspended micro-structures 63
A novel MEMS-tunable hairpin line filter on silicon substrate 63
Long-term reliability of RF-MEMS dielectric-less capacitive switches 63
A new approach to wafer level thin-film encapsulation for RF-MEMS Switches 63
Reliability of RF MEMS switches due to charging effects and their circuital modelling 62
Microsystem Fabrication for Microphysiological Applications 61
The application of Makyoh (magic-mirror) topography for the study of deformations in dielectric membrane structures 61
Design and Manufacturing of a 5-bit MEMS Phase Shifter at K-band 61
Silicon Based micromachined Receiving Module for 38 GHz with Bonded GaAs Schottky Detector Diode 61
Micromachined Switches: Realization and Test 60
Characterization of TMAH Silicon Etchant Using Ammomium Persulfate as an Oxidizing Agent 60
Fabrication of a piston-type condenser microphone with structured polysilicon diaphragm 60
Micromachined Low Actuation Voltage RF MEMS Capacitive Switches - Technology and Characterization 60
A highly-repeatable, broadband 180º phase switch for integrated MEMS 60
Tappered walls via holes manufactured using DRIE variable isotropy process 60
A Discretely Tuned RF-MEMS Bandstop Filter with Wide Tuning Range and Uniform High Rejection 60
Tapered walls via holes manufactured using DRIE variable isotropy process 60
38 GHz Antennas on Micromachined Silicon Substrates 60
Influence of masking layer stress on anisotropic silicon etching in TMAH solutions 60
Microphysical Characterization and Residual Stress Analysis of Thin Polymide Membranes on GaAs Substrate, Supporto for Micromachined Structures 59
Phenomenological modeling of MEMS switches for microwave applications 59
TiN Diffusion Barrier and Ti cap for Double Metal I.C. Interconnects 59
Characterization of TMAH Silicon Etchant Using Ammonium Persulfate as an Oxidizing Agent 59
RF-MEMS Based Switch Matrices for Complex Switching Networks 59
Variable isotropy Deep RIE process for through wafer via holes manufacturing 59
A Flexible Technology Platform for the Fabrication of RF-MEMS Devices 59
Design of Coplanar Micromachined Microwave Circuits 58
Low power Silicon microheaters on a thin dielectric membrane with Thick Film Sensing Layer for gas sensor applications 58
Microstructures etched in doped TMAH solutions 58
Novel Compact MEMS-Tunable Directional Coupler for Dual Band Wireless Applications 58
RF-MEMS switch design optimization for long-term reliability 58
A new approach to wafer level thin-film encapsulation for RF-MEMS Switches 58
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 58
Totale 7.049
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Categoria #
all - tutte 81.014
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 81.014
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/201965 0 0 0 0 0 0 0 0 0 0 44 21
2019/20202.388 266 259 17 14 321 192 327 40 308 155 310 179
2020/20212.682 362 69 291 158 279 77 339 29 24 453 146 455
2021/20221.304 54 88 9 196 81 28 39 205 109 72 176 247
2022/20233.767 96 222 72 685 261 598 67 287 924 313 149 93
2023/20242.227 313 110 277 101 185 202 139 358 102 432 8 0
Totale 14.666