In this work we present the microfabrication process for micro-electrode arrays (MEAs) designed for monitoring the electrophysiological behavior of neuron networks.The developed devices mainly consist of planar multi-electrodes and three-dimensional structures for cell guided growth and networking.Starting from a quartz wafer (double polished optical prime grade material, flame fused quartz, thickness 0.5 mm) the proposed fabrication process implements a Ti/TiN/Al/TiN low resistance multilayer for all the wires and electrical connections. All the exposed surfaces of the microelectrodes are realized in an Au/Cr (150nm/5nm) double layer: the thin Chromium layer is used in order to promote gold adhesion. The three-dimensional structures have been realized by means of a SU-8 negative resist. From a technological point of view, this research focused on obtaining i.) metal wires and electrodes with low resistivity and ii.) very thick SU-8 structures with improved performance in terms of adhesion. In order to implement well defined areas, connected by means of micro-channels, the development of reproducible procedure for SU-8 thick films deposition has been considered a central issue of this fabrication process.

A microelectrode array fabrication technology for electrophysiological measurements

Collini, Cristian;Lorenzelli, Leandro;Faes, Alessandro;Giacomozzi, Flavio;Margesin, Benno;
2006

Abstract

In this work we present the microfabrication process for micro-electrode arrays (MEAs) designed for monitoring the electrophysiological behavior of neuron networks.The developed devices mainly consist of planar multi-electrodes and three-dimensional structures for cell guided growth and networking.Starting from a quartz wafer (double polished optical prime grade material, flame fused quartz, thickness 0.5 mm) the proposed fabrication process implements a Ti/TiN/Al/TiN low resistance multilayer for all the wires and electrical connections. All the exposed surfaces of the microelectrodes are realized in an Au/Cr (150nm/5nm) double layer: the thin Chromium layer is used in order to promote gold adhesion. The three-dimensional structures have been realized by means of a SU-8 negative resist. From a technological point of view, this research focused on obtaining i.) metal wires and electrodes with low resistivity and ii.) very thick SU-8 structures with improved performance in terms of adhesion. In order to implement well defined areas, connected by means of micro-channels, the development of reproducible procedure for SU-8 thick films deposition has been considered a central issue of this fabrication process.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11582/3913
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