RF MEMS must be protected by a suitable package. A simple and cheap solution is to use quartz caps bonded by a polymer. This work reports on the use of ORDYL SY 355, a photosensitive dry film. The caps fabrication and bonding process were developed and tests were performed to define performance. Shear tests demonstrated good adhesion to the substrate and water immersion the sealing capability. Caps bonded on CPW and microstrip lines demonstrated negligible or very low impact on the RF performance in the 0-30GHz tested frequency band. Preliminary tests on capped RF MEMS switches indicated good performance of both capacitive and ohmic contact switches. Yield of ohmic switches resulted more sensitive to process conditions requiring a more accurate control.

Assessment of ORDYL SY 355 dry film for RF MEMS 0-level packaging

Giacomozzi, Flavio;Mattedi, Francesca;Margesin, Benno;Resta, Giuseppe;Mulloni, Viviana
2014

Abstract

RF MEMS must be protected by a suitable package. A simple and cheap solution is to use quartz caps bonded by a polymer. This work reports on the use of ORDYL SY 355, a photosensitive dry film. The caps fabrication and bonding process were developed and tests were performed to define performance. Shear tests demonstrated good adhesion to the substrate and water immersion the sealing capability. Caps bonded on CPW and microstrip lines demonstrated negligible or very low impact on the RF performance in the 0-30GHz tested frequency band. Preliminary tests on capped RF MEMS switches indicated good performance of both capacitive and ohmic contact switches. Yield of ohmic switches resulted more sensitive to process conditions requiring a more accurate control.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11582/239227
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