This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both cap-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic switches is reported indicating no loss of functionality but a modification of actuation voltage induced by the thermal treatment.
RF-MEMS chip capping by dry film epoxy polymer
Giacomozzi, Flavio;Colpo, Sabrina;Faes, Alessandro;Sordo, Guido;Girardi, Stefano;
2012-01-01
Abstract
This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both cap-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic switches is reported indicating no loss of functionality but a modification of actuation voltage induced by the thermal treatment.File in questo prodotto:
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