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EnglishThis paper presents for the first time influence of the silicon resistivity over the DRIE processes. Our aim was to develop a new process for tapered walls through silicon vias (TSVs) with a good control over the walls angle. Different wafer types were used and a dependency of resistivity was found, with an important impact over the TSVs shape. Solution found is presented and experiments performed to obtained designed TSVs.
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| Titolo: | Wafer resistivity influence over DRIE processes for TSVs manufacturing |
| Autori: | |
| Data di pubblicazione: | 2012 |
| Abstract: | This paper presents for the first time influence of the silicon resistivity over the DRIE processes. Our aim was to develop a new process for tapered walls through silicon vias (TSVs) with a good control over the walls angle. Different wafer types were used and a dependency of resistivity was found, with an important impact over the TSVs shape. Solution found is presented and experiments performed to obtained designed TSVs. |
| Handle: | http://hdl.handle.net/11582/122601 |
| ISBN: | 9781467307369 |
| Appare nelle tipologie: | 4.1 Contributo in Atti di convegno |
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http://hdl.handle.net/11582/122601
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