Ronchin, Sabina
 Distribuzione geografica
Continente #
EU - Europa 13.140
NA - Nord America 8.443
AS - Asia 4.203
SA - Sud America 974
Continente sconosciuto - Info sul continente non disponibili 210
AF - Africa 99
OC - Oceania 2
Totale 27.071
Nazione #
US - Stati Uniti d'America 8.230
IT - Italia 5.950
RU - Federazione Russa 4.539
SG - Singapore 1.502
BR - Brasile 817
HK - Hong Kong 763
CN - Cina 751
DE - Germania 673
VN - Vietnam 663
SE - Svezia 395
UA - Ucraina 350
FI - Finlandia 320
FR - Francia 198
GB - Regno Unito 166
NL - Olanda 136
IE - Irlanda 126
IN - India 126
CA - Canada 117
PL - Polonia 56
BE - Belgio 55
JP - Giappone 54
MX - Messico 54
AR - Argentina 52
ES - Italia 51
IL - Israele 49
BD - Bangladesh 48
TR - Turchia 42
IQ - Iraq 36
ZA - Sudafrica 31
EC - Ecuador 29
CZ - Repubblica Ceca 25
EU - Europa 25
CO - Colombia 24
AT - Austria 22
IR - Iran 21
PH - Filippine 21
VE - Venezuela 20
CH - Svizzera 19
LT - Lituania 19
PK - Pakistan 19
MA - Marocco 17
UZ - Uzbekistan 17
ID - Indonesia 13
AE - Emirati Arabi Uniti 12
CL - Cile 11
JO - Giordania 11
SA - Arabia Saudita 10
MY - Malesia 9
PY - Paraguay 9
EG - Egitto 8
JM - Giamaica 8
KE - Kenya 8
AL - Albania 7
CR - Costa Rica 7
HN - Honduras 7
RO - Romania 7
TN - Tunisia 7
DZ - Algeria 6
GR - Grecia 6
PE - Perù 6
SN - Senegal 6
DK - Danimarca 5
ET - Etiopia 5
KR - Corea 5
AZ - Azerbaigian 4
DO - Repubblica Dominicana 4
SC - Seychelles 4
TT - Trinidad e Tobago 4
UY - Uruguay 4
AO - Angola 3
BY - Bielorussia 3
KH - Cambogia 3
KZ - Kazakistan 3
NP - Nepal 3
OM - Oman 3
SV - El Salvador 3
BO - Bolivia 2
CM - Camerun 2
HR - Croazia 2
LB - Libano 2
MD - Moldavia 2
NI - Nicaragua 2
PS - Palestinian Territory 2
PT - Portogallo 2
RS - Serbia 2
TH - Thailandia 2
AM - Armenia 1
AU - Australia 1
BB - Barbados 1
BG - Bulgaria 1
BH - Bahrain 1
CI - Costa d'Avorio 1
CY - Cipro 1
DM - Dominica 1
FJ - Figi 1
GD - Grenada 1
GE - Georgia 1
GT - Guatemala 1
HU - Ungheria 1
KG - Kirghizistan 1
Totale 26.876
Città #
Rende 1.828
San Jose 1.004
Council Bluffs 856
Chandler 802
Singapore 780
Hong Kong 737
Jacksonville 731
Ashburn 532
Montalto Uffugo 331
Dallas 330
Moscow 288
Beijing 255
The Dalles 242
Roccella Jonica 240
Boardman 223
Wilmington 212
Castrolibero 209
Helsinki 189
Delianuova 183
Ho Chi Minh City 174
Los Angeles 166
Cosenza 165
Petilia Policastro 164
Crotone 155
Hanoi 143
Ann Arbor 141
New York 134
Santa Clara 132
Hefei 130
Dong Ket 127
Dublin 126
Trento 126
Kronberg 115
Lauterbourg 111
Paola 110
Reggio Calabria 108
Munich 106
Dearborn 104
São Paulo 71
Brooklyn 60
Woodbridge 56
Brussels 55
Catanzaro 54
Strongoli 54
Phoenix 52
Seattle 51
Nocera Terinese 46
Warsaw 45
Houston 44
Tokyo 44
Turku 43
Orem 41
Atlanta 38
Castrovillari 38
Guangzhou 38
Pedace 38
Toronto 38
Frankfurt am Main 37
Bocale 36
Denver 35
Pune 33
Da Nang 31
Praia A Mare 29
Rio de Janeiro 29
Rogliano 28
Chennai 27
Mountain View 27
Redwood City 27
Shanghai 27
Falkenstein 26
Montreal 26
Poplar 26
Acireale 25
Johannesburg 24
Lamézia 24
Rosarno 24
Terranova Da Síbari 24
Haiphong 23
London 23
Boston 22
Chicago 22
Falls Church 22
Lungro 22
Nuremberg 22
Sellia 22
Simeri 22
Brno 21
Rome 20
Vibo Valentia 20
Zaccanopoli 20
Mexico City 19
Miami 19
Stockholm 19
Amsterdam 18
Ankara 18
Bagnara Calabra 18
Charlotte 18
Santa Caterina Albanese 18
Barcelona 16
Capo Rizzuto 16
Totale 14.440
Nome #
The INFN–FBK “Phase-2” R&D program 5.789
Simulation and test of 3D silicon radiation detectors 384
3D-FBK pixel sensors: Recent beam tests results with irradiated devices 270
An improved all-p-type multiguard termination structure for silicon radiation detectors 269
3D detectors at ITC-irst: first irradiation studies 268
3D stc sensors with different strip isolation schemes and substrate materials 256
3D silicon strip detectors 249
3D trenched-electrode sensors for charged particle tracking and timing 239
32-Channel Detection Unit for Combined XRF-XRD in Mining Transportable Applications 233
An improved all-p-type multiguard termination structure for silicon radiation detectors. 229
Micromachined Silicon Radiation Sensors – Part 1: Design And Experimental Characterization 225
Characterization of 3D-DDTC detectors on p-type substrates 223
An improved termination structure for silicon radiation detectors with all-p-type multiguard and cut-line implants 217
Characterization of 3D-stc detectors fabricated at ITC-irst 215
Fabrication and characterization of n-on-n silicon pixel detectors compatible with the Medipix2 readout chip 215
Recent results from the development of silicon detectors with integrated electronics 215
First electrical characterization of 3D detectors with electrodes of the same doping type 213
Characterization and TCAD modelling of termination structures for silicon radiation detectors 213
Development of 3D detectors at FBK-irst 212
32-Channel silicon strip detection module for combined X-ray fluorescence spectroscopy and X-ray diffractometry analysis 211
Development of a new generation of 3D pixel sensors for HL-LHC 210
Characterization and TCAD modelling of all-p-type termination structures for silicon radiation detectors 210
Beam Test Measurements with 3D-DDTC Silicon Strip Detectors on n-type Substrate 209
A study for the detection of ionizing particles with phototransistors on thick high-resistivity silicon substrates 209
Micromachined Silicon Radiation Sensors – Part 2: Fabrication Technologies 207
Characterization and modelling of signal dynamics in 3D-DDTC detectors 196
Charge collection measurements in single-type column 3D sensors 196
Recent results from the development of silicon detectors with integrated electronics 196
Simulations and Electrical Characterization of Double-side Double Type Column 3D Detectors 195
Advances in 3D Sensor Technology by Using Stepper Lithography 194
Fabrication of 3D detectors with columnar electrodes of the same doping type 192
Tappered walls via holes manufactured using DRIE variable isotropy process 191
Tapered walls via holes manufactured using DRIE variable isotropy process 190
Characterization of BJT-based particle detectors 189
Silicon Buried Channels for Pixel Detector Cooling 188
New Deep Reactive Ion Etching process for through wafer via manufacturing 186
Variable isotropy Deep RIE process for through wafer via holes manufacturing 186
Silicon Buried Channels for Pixel Detector Cooling 182
Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers 182
Development of radiation tolerant semiconductor detectors for the Super-LHC 181
Hybrid Detectors of Neutrons Based on 3D Silicon Sensors with Polysiloxanes Converter 181
Development of LGAD sensors with a thin entrance window for soft X-ray detection 180
Hybrid Detectors for Neutrons Combining Phenyl-Polysiloxanes with 3D Silicon Detectors 178
Beam Test Results of Thin n-in-p 3D and Planar Pixel Sensors for the High Luminosity LHC Tracker Upgrade at CMS 178
Small pitch 3D devices 177
Active-edge FBK-INFN-LPNHE thin n-on-p pixel sensors for the upgrade of the ATLAS Inner Tracker 177
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 176
Development and production of advanced 3D pixel sensors at FBK 175
Development of 3D-DDTC pixel detectors for the ATLAS upgrade 175
Recent advancements in the development of radiation hard semiconductor detectors for S-LHC 174
V-shape through wafer via manufactured by drie variable isotropy process 174
PFM2: a 32 × 32 processor for X-ray diffraction imaging at FELs 172
Development of 3D detectors featuring columnar electrodes of the same doping type 171
ASIX: Single-photon, energy resolved X-ray imaging with 50 μm hexagonal hybrid pixel 170
INFN-FBK developments of 3D sensors for High-Luminosity LHC 170
Laser characterisation of a 3D single-type column p-type prototype module read out with ATLAS SCT electronics 169
Tapered walls via holes manufactured using DRIE variable isotropy process 169
First production of new thin 3D sensors for HL-LHC at FBK 169
Study of the internal quantum efficiency of FBK sensors with optimized entrance windows 167
Position Sensitive TCT Evaluation of Irradiated 3D-stc Detectors 167
R&D for new silicon pixel sensors for the High Luminosity phase of the CMS experiment at LHC 167
Characterization of 3D and planar Si diodes with different neutron converter materials 167
First experimental results on active and slim-edge silicon sensors for XFEL 166
Double-Sided, Double-Type-Column 3-D Detectors: Design, Fabrication, and Technology Evaluation 165
Development of new 3D pixel sensors for phase 2 upgrades at LHC 163
Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection 163
Development of radiation hard silicon detectors: the SMART project 160
High-gain phototransistors on high-resistivity silicon substrate 158
Measurements of 3D Silicon Strip Sensors by Two Manufacturers 157
Analysis of the Radiation Hardness and Charge Collection Efficiency of Thinned Silicon Diodes 157
Functional Characterization of 3D-DDTC Detectors Fabricated at FBK-irst 156
Efficiency measurements for 3D silicon strip detectors 156
Characterization of iLGADs using soft X-rays 156
Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade 155
Development of 3D trenched-electrode pixel sensors with improved timing performance 154
Review of R&D activities on silicon particle detectors at ITC-irst 153
Radiation hardness of high resistivity n- and p-type magnetic Czochralski silicon 153
Electro-optical measurements of 3D-stc detectors fabricated at ITC-irst 153
Fabrication of novel MEMS microgrippers by deep reactive ion etching with metal hard mask 153
Novel 3D silicon sensors for neutron detection 151
Radiation resistant innovative 3D pixel sensors for the CMS upgrade at the High Luminosity LHC 151
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015 neq/cm2 149
Investigation of 3D Silicon Microstrip Detectors for the sLHC 148
A Method for Comparing Dry Etch Equipment and Transferring Etch Recipes 145
Radiation Hardness and Charge Collection Efficiency of Lithium Irradiated Thin Silicon Diodes 143
Laser and beta source setup characterization of 3D-DDTC detectors fabricated at FBK-irst 143
Fabrication of PIN diode detectors on thinned silicon wafers 143
A Three-Dimensional Gated Diode Structure for Surface Parameter Characterization in a 3D Sensor Technology 143
Radiation-hard semiconductor detectors for SuperLHC 142
Processing and first characterization of detectors made with high resistivity n- and p-type Czochralski silicon 140
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade 140
Characterization of micro-strip detectors made with high resistivity n- and p-type Czochralski silicon 138
Silicon Detectors for the sLHC 138
Study of the signal formation in single-type column 3D silicon detectors 137
Test beam measurements with 3D silicon strip detectors 137
The SMART detectors: development of radiation hard silicon devices for SLHC 137
Er3+ / Yb3+ codoped silica-titania planar waveguides prepared by rf-sputtering 134
Silicon microstrip detectors in 3D technology for the sLHC 134
Thin and edgeless sensors for ATLAS pixel detector upgrade 134
SiCILIA-Silicon Carbide Detectors for Intense Luminosity Investigations and Applications 133
Totale 23.675
Categoria #
all - tutte 93.826
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 93.826


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022588 0 0 21 73 48 12 15 102 45 21 102 149
2022/20231.674 49 129 37 315 106 266 22 111 413 153 52 21
2023/20241.145 116 70 116 31 65 127 53 161 50 150 21 185
2024/20254.077 51 118 506 70 273 64 133 219 1.313 460 525 345
2025/202610.037 342 554 722 824 457 425 1.484 3.505 611 435 503 175
2026/20271.183 417 344 422 0 0 0 0 0 0 0 0 0
Totale 27.071