IRIS Institutional Research Information System

Ronchin, Sabina
 Distribuzione geografica
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Continente #
EU - Europa 13.075
NA - Nord America 7.737
AS - Asia 4.184
SA - Sud America 966
AF - Africa 99
Continente sconosciuto - Info sul continente non disponibili 25
OC - Oceania 2
Totale 26.088
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Nazione #
US - Stati Uniti d'America 7.537
IT - Italia 5.935
RU - Federazione Russa 4.538
SG - Singapore 1.499
BR - Brasile 815
HK - Hong Kong 762
CN - Cina 748
DE - Germania 673
VN - Vietnam 663
UA - Ucraina 350
SE - Svezia 347
FI - Finlandia 320
FR - Francia 198
GB - Regno Unito 166
NL - Olanda 136
IE - Irlanda 126
IN - India 126
CA - Canada 113
PL - Polonia 56
BE - Belgio 55
MX - Messico 54
JP - Giappone 53
AR - Argentina 52
ES - Italia 51
IL - Israele 49
BD - Bangladesh 46
TR - Turchia 42
IQ - Iraq 36
ZA - Sudafrica 31
EC - Ecuador 26
CZ - Repubblica Ceca 25
EU - Europa 25
CO - Colombia 23
AT - Austria 22
IR - Iran 21
CH - Svizzera 19
LT - Lituania 19
PK - Pakistan 18
VE - Venezuela 18
MA - Marocco 17
UZ - Uzbekistan 17
PH - Filippine 16
AE - Emirati Arabi Uniti 12
ID - Indonesia 12
CL - Cile 11
JO - Giordania 11
SA - Arabia Saudita 10
PY - Paraguay 9
EG - Egitto 8
KE - Kenya 8
MY - Malesia 8
AL - Albania 7
RO - Romania 7
TN - Tunisia 7
DZ - Algeria 6
GR - Grecia 6
HN - Honduras 6
PE - Perù 6
SN - Senegal 6
CR - Costa Rica 5
DK - Danimarca 5
ET - Etiopia 5
KR - Corea 5
AZ - Azerbaigian 4
DO - Repubblica Dominicana 4
JM - Giamaica 4
SC - Seychelles 4
TT - Trinidad e Tobago 4
UY - Uruguay 4
AO - Angola 3
BY - Bielorussia 3
KH - Cambogia 3
KZ - Kazakistan 3
NP - Nepal 3
OM - Oman 3
SV - El Salvador 3
BO - Bolivia 2
CM - Camerun 2
HR - Croazia 2
LB - Libano 2
NI - Nicaragua 2
PS - Palestinian Territory 2
PT - Portogallo 2
RS - Serbia 2
TH - Thailandia 2
AM - Armenia 1
AU - Australia 1
BG - Bulgaria 1
BH - Bahrain 1
CI - Costa d'Avorio 1
CY - Cipro 1
DM - Dominica 1
FJ - Figi 1
GD - Grenada 1
GT - Guatemala 1
HU - Ungheria 1
KG - Kirghizistan 1
KW - Kuwait 1
LV - Lettonia 1
MD - Moldavia 1
Totale 26.081
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Città #
Rende 1.828
San Jose 864
Chandler 802
Singapore 777
Hong Kong 736
Jacksonville 731
Council Bluffs 725
Ashburn 511
Montalto Uffugo 331
Dallas 326
Moscow 288
Beijing 252
The Dalles 242
Roccella Jonica 240
Boardman 223
Castrolibero 209
Wilmington 209
Helsinki 189
Delianuova 183
Ho Chi Minh City 174
Cosenza 165
Petilia Policastro 164
Crotone 155
Los Angeles 152
Hanoi 143
Ann Arbor 141
Hefei 130
New York 130
Dong Ket 127
Dublin 126
Trento 126
Santa Clara 124
Kronberg 115
Lauterbourg 111
Paola 110
Reggio Calabria 108
Munich 106
Dearborn 104
São Paulo 71
Brooklyn 58
Woodbridge 56
Brussels 55
Catanzaro 54
Strongoli 54
Seattle 48
Nocera Terinese 46
Warsaw 45
Tokyo 44
Turku 43
Orem 41
Castrovillari 38
Guangzhou 38
Pedace 38
Frankfurt am Main 37
Houston 37
Phoenix 37
Toronto 37
Bocale 36
Atlanta 34
Denver 33
Pune 33
Da Nang 31
Praia A Mare 29
Rio de Janeiro 29
Rogliano 28
Chennai 27
Mountain View 27
Redwood City 27
Shanghai 27
Falkenstein 26
Montreal 26
Poplar 26
Acireale 25
Johannesburg 24
Lamézia 24
Rosarno 24
Terranova Da Síbari 24
Haiphong 23
London 23
Boston 22
Falls Church 22
Lungro 22
Nuremberg 22
Sellia 22
Simeri 22
Brno 21
Rome 20
Vibo Valentia 20
Zaccanopoli 20
Chicago 19
Mexico City 19
Stockholm 19
Amsterdam 18
Ankara 18
Bagnara Calabra 18
Santa Caterina Albanese 18
Barcelona 16
Capo Rizzuto 16
Corigliano Calabro 16
Padova 16
Totale 14.066
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Nome #
The INFN–FBK “Phase-2” R&D program 5.781
Simulation and test of 3D silicon radiation detectors 377
An improved all-p-type multiguard termination structure for silicon radiation detectors 265
3D-FBK pixel sensors: Recent beam tests results with irradiated devices 264
3D detectors at ITC-irst: first irradiation studies 258
3D stc sensors with different strip isolation schemes and substrate materials 249
3D silicon strip detectors 240
3D trenched-electrode sensors for charged particle tracking and timing 233
32-Channel Detection Unit for Combined XRF-XRD in Mining Transportable Applications 230
An improved all-p-type multiguard termination structure for silicon radiation detectors. 223
Micromachined Silicon Radiation Sensors – Part 1: Design And Experimental Characterization 216
Characterization of 3D-DDTC detectors on p-type substrates 212
Fabrication and characterization of n-on-n silicon pixel detectors compatible with the Medipix2 readout chip 210
An improved termination structure for silicon radiation detectors with all-p-type multiguard and cut-line implants 209
Recent results from the development of silicon detectors with integrated electronics 208
Characterization of 3D-stc detectors fabricated at ITC-irst 207
First electrical characterization of 3D detectors with electrodes of the same doping type 206
Development of 3D detectors at FBK-irst 206
32-Channel silicon strip detection module for combined X-ray fluorescence spectroscopy and X-ray diffractometry analysis 205
Characterization and TCAD modelling of termination structures for silicon radiation detectors 205
Beam Test Measurements with 3D-DDTC Silicon Strip Detectors on n-type Substrate 203
A study for the detection of ionizing particles with phototransistors on thick high-resistivity silicon substrates 203
Development of a new generation of 3D pixel sensors for HL-LHC 203
Micromachined Silicon Radiation Sensors – Part 2: Fabrication Technologies 203
Characterization and TCAD modelling of all-p-type termination structures for silicon radiation detectors 203
Characterization and modelling of signal dynamics in 3D-DDTC detectors 192
Recent results from the development of silicon detectors with integrated electronics 191
Charge collection measurements in single-type column 3D sensors 190
Simulations and Electrical Characterization of Double-side Double Type Column 3D Detectors 188
Advances in 3D Sensor Technology by Using Stepper Lithography 188
Fabrication of 3D detectors with columnar electrodes of the same doping type 185
Tapered walls via holes manufactured using DRIE variable isotropy process 183
Tappered walls via holes manufactured using DRIE variable isotropy process 182
Characterization of BJT-based particle detectors 181
Silicon Buried Channels for Pixel Detector Cooling 180
Variable isotropy Deep RIE process for through wafer via holes manufacturing 180
New Deep Reactive Ion Etching process for through wafer via manufacturing 179
Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers 176
Development of radiation tolerant semiconductor detectors for the Super-LHC 175
Silicon Buried Channels for Pixel Detector Cooling 175
Hybrid Detectors of Neutrons Based on 3D Silicon Sensors with Polysiloxanes Converter 174
Small pitch 3D devices 173
Beam Test Results of Thin n-in-p 3D and Planar Pixel Sensors for the High Luminosity LHC Tracker Upgrade at CMS 172
Active-edge FBK-INFN-LPNHE thin n-on-p pixel sensors for the upgrade of the ATLAS Inner Tracker 172
Hybrid Detectors for Neutrons Combining Phenyl-Polysiloxanes with 3D Silicon Detectors 171
Development of 3D-DDTC pixel detectors for the ATLAS upgrade 169
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 169
Development of LGAD sensors with a thin entrance window for soft X-ray detection 168
PFM2: a 32 × 32 processor for X-ray diffraction imaging at FELs 167
Recent advancements in the development of radiation hard semiconductor detectors for S-LHC 166
INFN-FBK developments of 3D sensors for High-Luminosity LHC 166
V-shape through wafer via manufactured by drie variable isotropy process 165
Development of 3D detectors featuring columnar electrodes of the same doping type 164
First production of new thin 3D sensors for HL-LHC at FBK 164
Development and production of advanced 3D pixel sensors at FBK 163
Laser characterisation of a 3D single-type column p-type prototype module read out with ATLAS SCT electronics 163
Study of the internal quantum efficiency of FBK sensors with optimized entrance windows 162
Position Sensitive TCT Evaluation of Irradiated 3D-stc Detectors 162
Characterization of 3D and planar Si diodes with different neutron converter materials 162
First experimental results on active and slim-edge silicon sensors for XFEL 162
Tapered walls via holes manufactured using DRIE variable isotropy process 161
R&D for new silicon pixel sensors for the High Luminosity phase of the CMS experiment at LHC 161
Double-Sided, Double-Type-Column 3-D Detectors: Design, Fabrication, and Technology Evaluation 160
ASIX: Single-photon, energy resolved X-ray imaging with 50 μm hexagonal hybrid pixel 159
Development of new 3D pixel sensors for phase 2 upgrades at LHC 158
Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection 158
Development of radiation hard silicon detectors: the SMART project 156
High-gain phototransistors on high-resistivity silicon substrate 152
Measurements of 3D Silicon Strip Sensors by Two Manufacturers 151
Efficiency measurements for 3D silicon strip detectors 150
Analysis of the Radiation Hardness and Charge Collection Efficiency of Thinned Silicon Diodes 150
Development of 3D trenched-electrode pixel sensors with improved timing performance 150
Functional Characterization of 3D-DDTC Detectors Fabricated at FBK-irst 149
Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade 149
Fabrication of novel MEMS microgrippers by deep reactive ion etching with metal hard mask 148
Characterization of iLGADs using soft X-rays 148
Radiation resistant innovative 3D pixel sensors for the CMS upgrade at the High Luminosity LHC 147
Review of R&D activities on silicon particle detectors at ITC-irst 146
Electro-optical measurements of 3D-stc detectors fabricated at ITC-irst 146
Radiation hardness of high resistivity n- and p-type magnetic Czochralski silicon 145
Novel 3D silicon sensors for neutron detection 144
Investigation of 3D Silicon Microstrip Detectors for the sLHC 143
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015 neq/cm2 142
A Method for Comparing Dry Etch Equipment and Transferring Etch Recipes 141
A Three-Dimensional Gated Diode Structure for Surface Parameter Characterization in a 3D Sensor Technology 140
Laser and beta source setup characterization of 3D-DDTC detectors fabricated at FBK-irst 138
Radiation Hardness and Charge Collection Efficiency of Lithium Irradiated Thin Silicon Diodes 137
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade 137
Radiation-hard semiconductor detectors for SuperLHC 136
Fabrication of PIN diode detectors on thinned silicon wafers 136
Processing and first characterization of detectors made with high resistivity n- and p-type Czochralski silicon 135
Study of the signal formation in single-type column 3D silicon detectors 134
Test beam measurements with 3D silicon strip detectors 132
Silicon Detectors for the sLHC 131
Thin and edgeless sensors for ATLAS pixel detector upgrade 131
Characterization of micro-strip detectors made with high resistivity n- and p-type Czochralski silicon 130
The SMART detectors: development of radiation hard silicon devices for SLHC 130
Er3+ / Yb3+ codoped silica-titania planar waveguides prepared by rf-sputtering 129
SiCILIA-Silicon Carbide Detectors for Intense Luminosity Investigations and Applications 129
Silicon microstrip detectors in 3D technology for the sLHC 128
Totale 23.045
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Categoria #
all - tutte 89.642
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 89.642
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022645 24 33 21 73 48 12 15 102 45 21 102 149
2022/20231.674 49 129 37 315 106 266 22 111 413 153 52 21
2023/20241.145 116 70 116 31 65 127 53 161 50 150 21 185
2024/20254.077 51 118 506 70 273 64 133 219 1.313 460 525 345
2025/202610.037 342 554 722 824 457 425 1.484 3.505 611 435 503 175
2026/2027385 385 0 0 0 0 0 0 0 0 0 0 0
Totale 26.273