IRIS Institutional Research Information System

Ronchin, Sabina
 Distribuzione geografica
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Continente #
EU - Europa 13.036
NA - Nord America 6.887
AS - Asia 4.124
SA - Sud America 957
AF - Africa 99
Continente sconosciuto - Info sul continente non disponibili 25
OC - Oceania 2
Totale 25.130
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Nazione #
US - Stati Uniti d'America 6.694
IT - Italia 5.911
RU - Federazione Russa 4.537
SG - Singapore 1.479
BR - Brasile 811
HK - Hong Kong 759
CN - Cina 720
DE - Germania 669
VN - Vietnam 662
UA - Ucraina 349
SE - Svezia 347
FI - Finlandia 320
FR - Francia 197
GB - Regno Unito 166
NL - Olanda 135
IE - Irlanda 126
IN - India 126
CA - Canada 107
PL - Polonia 56
BE - Belgio 55
MX - Messico 54
AR - Argentina 52
JP - Giappone 52
ES - Italia 50
IL - Israele 49
BD - Bangladesh 46
TR - Turchia 40
IQ - Iraq 36
ZA - Sudafrica 31
EC - Ecuador 26
CZ - Repubblica Ceca 25
EU - Europa 25
AT - Austria 22
CO - Colombia 21
IR - Iran 21
LT - Lituania 19
PK - Pakistan 18
CH - Svizzera 17
MA - Marocco 17
UZ - Uzbekistan 17
VE - Venezuela 17
PH - Filippine 16
ID - Indonesia 12
AE - Emirati Arabi Uniti 11
JO - Giordania 11
CL - Cile 10
SA - Arabia Saudita 10
EG - Egitto 8
KE - Kenya 8
PY - Paraguay 8
AL - Albania 7
TN - Tunisia 7
DZ - Algeria 6
GR - Grecia 6
HN - Honduras 6
PE - Perù 6
SN - Senegal 6
DK - Danimarca 5
ET - Etiopia 5
KR - Corea 5
AZ - Azerbaigian 4
CR - Costa Rica 4
DO - Repubblica Dominicana 4
JM - Giamaica 4
MY - Malesia 4
RO - Romania 4
SC - Seychelles 4
TT - Trinidad e Tobago 4
UY - Uruguay 4
AO - Angola 3
BY - Bielorussia 3
KH - Cambogia 3
KZ - Kazakistan 3
NP - Nepal 3
OM - Oman 3
SV - El Salvador 3
BO - Bolivia 2
CM - Camerun 2
HR - Croazia 2
LB - Libano 2
NI - Nicaragua 2
PS - Palestinian Territory 2
PT - Portogallo 2
RS - Serbia 2
TH - Thailandia 2
AM - Armenia 1
AU - Australia 1
BH - Bahrain 1
CI - Costa d'Avorio 1
CY - Cipro 1
DM - Dominica 1
FJ - Figi 1
GD - Grenada 1
GT - Guatemala 1
HU - Ungheria 1
KG - Kirghizistan 1
KW - Kuwait 1
LV - Lettonia 1
MD - Moldavia 1
MO - Macao, regione amministrativa speciale della Cina 1
Totale 25.124
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Città #
Rende 1.828
San Jose 864
Chandler 801
Singapore 775
Hong Kong 735
Jacksonville 730
Ashburn 505
Montalto Uffugo 331
Dallas 325
Moscow 288
Beijing 251
The Dalles 242
Roccella Jonica 240
Boardman 223
Castrolibero 209
Wilmington 208
Helsinki 189
Delianuova 183
Ho Chi Minh City 174
Cosenza 165
Petilia Policastro 164
Crotone 155
Los Angeles 152
Hanoi 143
Ann Arbor 141
Hefei 130
Dong Ket 127
New York 127
Dublin 126
Santa Clara 121
Trento 120
Kronberg 115
Lauterbourg 111
Paola 110
Reggio Calabria 108
Munich 106
Dearborn 104
São Paulo 71
Woodbridge 56
Brooklyn 55
Brussels 55
Strongoli 54
Catanzaro 50
Seattle 48
Nocera Terinese 46
Warsaw 45
Tokyo 44
Turku 43
Orem 40
Castrovillari 38
Guangzhou 38
Pedace 38
Frankfurt am Main 37
Bocale 36
Houston 36
Phoenix 36
Toronto 36
Pune 33
Denver 32
Atlanta 31
Da Nang 31
Praia A Mare 29
Rio de Janeiro 29
Rogliano 28
Chennai 27
Mountain View 27
Redwood City 27
Shanghai 27
Falkenstein 26
Montreal 26
Poplar 26
Acireale 25
Johannesburg 24
Lamézia 24
Rosarno 24
Terranova Da Síbari 24
London 23
Boston 22
Falls Church 22
Haiphong 22
Lungro 22
Nuremberg 22
Sellia 22
Simeri 22
Brno 21
Vibo Valentia 20
Zaccanopoli 20
Chicago 19
Mexico City 19
Stockholm 19
Amsterdam 18
Ankara 18
Bagnara Calabra 18
Rome 18
Santa Caterina Albanese 18
Barcelona 16
Capo Rizzuto 16
Corigliano Calabro 16
Padova 16
Taurianova 16
Totale 13.313
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Nome #
The INFN–FBK “Phase-2” R&D program 5.773
Simulation and test of 3D silicon radiation detectors 370
3D-FBK pixel sensors: Recent beam tests results with irradiated devices 260
An improved all-p-type multiguard termination structure for silicon radiation detectors 257
3D detectors at ITC-irst: first irradiation studies 250
3D stc sensors with different strip isolation schemes and substrate materials 243
3D silicon strip detectors 229
3D trenched-electrode sensors for charged particle tracking and timing 227
32-Channel Detection Unit for Combined XRF-XRD in Mining Transportable Applications 221
An improved all-p-type multiguard termination structure for silicon radiation detectors. 213
Micromachined Silicon Radiation Sensors – Part 1: Design And Experimental Characterization 208
Fabrication and characterization of n-on-n silicon pixel detectors compatible with the Medipix2 readout chip 205
Characterization of 3D-DDTC detectors on p-type substrates 204
Recent results from the development of silicon detectors with integrated electronics 203
An improved termination structure for silicon radiation detectors with all-p-type multiguard and cut-line implants 201
First electrical characterization of 3D detectors with electrodes of the same doping type 200
32-Channel silicon strip detection module for combined X-ray fluorescence spectroscopy and X-ray diffractometry analysis 199
Characterization of 3D-stc detectors fabricated at ITC-irst 199
Development of 3D detectors at FBK-irst 199
Characterization and TCAD modelling of termination structures for silicon radiation detectors 198
Micromachined Silicon Radiation Sensors – Part 2: Fabrication Technologies 198
Characterization and TCAD modelling of all-p-type termination structures for silicon radiation detectors 198
Development of a new generation of 3D pixel sensors for HL-LHC 196
Beam Test Measurements with 3D-DDTC Silicon Strip Detectors on n-type Substrate 194
A study for the detection of ionizing particles with phototransistors on thick high-resistivity silicon substrates 193
Characterization and modelling of signal dynamics in 3D-DDTC detectors 186
Recent results from the development of silicon detectors with integrated electronics 184
Charge collection measurements in single-type column 3D sensors 183
Simulations and Electrical Characterization of Double-side Double Type Column 3D Detectors 181
Fabrication of 3D detectors with columnar electrodes of the same doping type 180
Tapered walls via holes manufactured using DRIE variable isotropy process 178
Tappered walls via holes manufactured using DRIE variable isotropy process 175
Silicon Buried Channels for Pixel Detector Cooling 174
New Deep Reactive Ion Etching process for through wafer via manufacturing 173
Variable isotropy Deep RIE process for through wafer via holes manufacturing 173
Characterization of BJT-based particle detectors 171
Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers 170
Development of radiation tolerant semiconductor detectors for the Super-LHC 169
Silicon Buried Channels for Pixel Detector Cooling 169
Advances in 3D Sensor Technology by Using Stepper Lithography 169
Hybrid Detectors of Neutrons Based on 3D Silicon Sensors with Polysiloxanes Converter 168
Beam Test Results of Thin n-in-p 3D and Planar Pixel Sensors for the High Luminosity LHC Tracker Upgrade at CMS 167
Active-edge FBK-INFN-LPNHE thin n-on-p pixel sensors for the upgrade of the ATLAS Inner Tracker 165
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 164
Development of LGAD sensors with a thin entrance window for soft X-ray detection 163
Hybrid Detectors for Neutrons Combining Phenyl-Polysiloxanes with 3D Silicon Detectors 163
Small pitch 3D devices 163
V-shape through wafer via manufactured by drie variable isotropy process 161
Development of 3D-DDTC pixel detectors for the ATLAS upgrade 161
PFM2: a 32 × 32 processor for X-ray diffraction imaging at FELs 161
Recent advancements in the development of radiation hard semiconductor detectors for S-LHC 160
Laser characterisation of a 3D single-type column p-type prototype module read out with ATLAS SCT electronics 159
Development and production of advanced 3D pixel sensors at FBK 156
INFN-FBK developments of 3D sensors for High-Luminosity LHC 156
Position Sensitive TCT Evaluation of Irradiated 3D-stc Detectors 156
Characterization of 3D and planar Si diodes with different neutron converter materials 156
First experimental results on active and slim-edge silicon sensors for XFEL 156
Development of 3D detectors featuring columnar electrodes of the same doping type 155
Tapered walls via holes manufactured using DRIE variable isotropy process 155
Study of the internal quantum efficiency of FBK sensors with optimized entrance windows 154
Double-Sided, Double-Type-Column 3-D Detectors: Design, Fabrication, and Technology Evaluation 154
Development of new 3D pixel sensors for phase 2 upgrades at LHC 153
R&D for new silicon pixel sensors for the High Luminosity phase of the CMS experiment at LHC 153
Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection 151
First production of new thin 3D sensors for HL-LHC at FBK 150
Development of radiation hard silicon detectors: the SMART project 148
Measurements of 3D Silicon Strip Sensors by Two Manufacturers 146
Development of 3D trenched-electrode pixel sensors with improved timing performance 146
High-gain phototransistors on high-resistivity silicon substrate 144
Functional Characterization of 3D-DDTC Detectors Fabricated at FBK-irst 144
Efficiency measurements for 3D silicon strip detectors 144
Analysis of the Radiation Hardness and Charge Collection Efficiency of Thinned Silicon Diodes 144
Fabrication of novel MEMS microgrippers by deep reactive ion etching with metal hard mask 142
Electro-optical measurements of 3D-stc detectors fabricated at ITC-irst 141
Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade 141
Radiation hardness of high resistivity n- and p-type magnetic Czochralski silicon 140
Characterization of iLGADs using soft X-rays 140
Review of R&D activities on silicon particle detectors at ITC-irst 139
Novel 3D silicon sensors for neutron detection 138
Investigation of 3D Silicon Microstrip Detectors for the sLHC 137
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015 neq/cm2 135
Radiation resistant innovative 3D pixel sensors for the CMS upgrade at the High Luminosity LHC 135
A Three-Dimensional Gated Diode Structure for Surface Parameter Characterization in a 3D Sensor Technology 134
Radiation-hard semiconductor detectors for SuperLHC 133
Radiation Hardness and Charge Collection Efficiency of Lithium Irradiated Thin Silicon Diodes 131
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade 131
A Method for Comparing Dry Etch Equipment and Transferring Etch Recipes 130
Processing and first characterization of detectors made with high resistivity n- and p-type Czochralski silicon 130
Laser and beta source setup characterization of 3D-DDTC detectors fabricated at FBK-irst 130
Study of the signal formation in single-type column 3D silicon detectors 128
Fabrication of PIN diode detectors on thinned silicon wafers 127
Silicon Detectors for the sLHC 126
Er3+ / Yb3+ codoped silica-titania planar waveguides prepared by rf-sputtering 125
Characterization of micro-strip detectors made with high resistivity n- and p-type Czochralski silicon 124
Test beam measurements with 3D silicon strip detectors 124
Thin and edgeless sensors for ATLAS pixel detector upgrade 124
The SMART detectors: development of radiation hard silicon devices for SLHC 124
Initial results from 3D-DDTC detectors on p-type substrates 122
Silicon microstrip detectors in 3D technology for the sLHC 122
High-gain bipolar phototransistor on high-resistivity silicon substrate: a new device for the detection of ionizing radiation 122
Totale 22.324
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Categoria #
all - tutte 85.711
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 85.711
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021232 0 0 0 0 0 0 0 0 0 0 50 182
2021/2022645 24 33 21 73 48 12 15 102 45 21 102 149
2022/20231.674 49 129 37 315 106 266 22 111 413 153 52 21
2023/20241.145 116 70 116 31 65 127 53 161 50 150 21 185
2024/20254.077 51 118 506 70 273 64 133 219 1.313 460 525 345
2025/20269.464 342 554 722 824 457 425 1.484 3.505 611 435 105 0
Totale 25.315