IRIS Institutional Research Information System

Ronchin, Sabina
 Distribuzione geografica
Salva come PNG Salva come JPEG
Continente #
EU - Europa 9.338
NA - Nord America 5.544
AS - Asia 2.887
SA - Sud America 831
AF - Africa 66
Continente sconosciuto - Info sul continente non disponibili 25
Totale 18.691
Salva come PNG Salva come JPEG
Nazione #
IT - Italia 5.873
US - Stati Uniti d'America 5.400
RU - Federazione Russa 1.226
SG - Singapore 1.117
BR - Brasile 730
HK - Hong Kong 592
DE - Germania 575
CN - Cina 559
UA - Ucraina 343
FI - Finlandia 315
SE - Svezia 304
VN - Vietnam 263
GB - Regno Unito 139
NL - Olanda 133
IE - Irlanda 123
IN - India 99
CA - Canada 89
FR - Francia 60
BE - Belgio 55
IL - Israele 49
PL - Polonia 49
ES - Italia 42
AR - Argentina 41
JP - Giappone 40
MX - Messico 37
TR - Turchia 30
BD - Bangladesh 27
CZ - Repubblica Ceca 25
EU - Europa 25
ZA - Sudafrica 23
EC - Ecuador 22
IR - Iran 20
LT - Lituania 18
AT - Austria 17
CH - Svizzera 17
IQ - Iraq 16
UZ - Uzbekistan 14
PK - Pakistan 13
CO - Colombia 12
MA - Marocco 11
VE - Venezuela 9
AE - Emirati Arabi Uniti 8
EG - Egitto 8
ID - Indonesia 7
KE - Kenya 7
JO - Giordania 6
TN - Tunisia 6
GR - Grecia 5
HN - Honduras 5
PE - Perù 5
SA - Arabia Saudita 5
CL - Cile 4
DK - Danimarca 4
KR - Corea 4
PY - Paraguay 4
DO - Repubblica Dominicana 3
JM - Giamaica 3
RO - Romania 3
SN - Senegal 3
AL - Albania 2
AO - Angola 2
AZ - Azerbaigian 2
BO - Bolivia 2
BY - Bielorussia 2
CR - Costa Rica 2
DZ - Algeria 2
ET - Etiopia 2
HR - Croazia 2
NP - Nepal 2
OM - Oman 2
PT - Portogallo 2
RS - Serbia 2
SC - Seychelles 2
TT - Trinidad e Tobago 2
UY - Uruguay 2
AM - Armenia 1
BH - Bahrain 1
CY - Cipro 1
DM - Dominica 1
GD - Grenada 1
KG - Kirghizistan 1
KH - Cambogia 1
KZ - Kazakistan 1
LB - Libano 1
LV - Lettonia 1
MO - Macao, regione amministrativa speciale della Cina 1
MY - Malesia 1
NI - Nicaragua 1
PH - Filippine 1
PS - Palestinian Territory 1
SK - Slovacchia (Repubblica Slovacca) 1
TW - Taiwan 1
Totale 18.691
Salva come PNG Salva come JPEG
Città #
Rende 1.828
Chandler 801
Jacksonville 729
Singapore 701
Hong Kong 584
Ashburn 395
Montalto Uffugo 331
Dallas 324
Moscow 288
Roccella Jonica 240
Beijing 227
Boardman 223
Castrolibero 209
Wilmington 208
The Dalles 198
Helsinki 184
Delianuova 183
Cosenza 165
Petilia Policastro 164
Crotone 155
Ann Arbor 141
Hefei 130
Dong Ket 127
Dublin 123
Trento 120
New York 119
Kronberg 115
Santa Clara 112
Paola 110
Reggio Calabria 108
Munich 106
Dearborn 104
Los Angeles 103
São Paulo 69
Woodbridge 56
Brussels 55
Strongoli 54
Brooklyn 52
Catanzaro 50
Ho Chi Minh City 47
Seattle 47
Nocera Terinese 46
Turku 43
Warsaw 41
Castrovillari 38
Pedace 38
Tokyo 37
Bocale 36
Phoenix 36
Houston 34
Pune 32
Toronto 32
Guangzhou 31
Hanoi 31
Praia A Mare 29
Rogliano 28
Mountain View 27
Redwood City 27
Rio de Janeiro 27
Denver 26
Falkenstein 26
Atlanta 25
Orem 25
Acireale 24
Lamézia 24
Rosarno 24
Terranova Da Síbari 24
Boston 22
Falls Church 22
Lungro 22
Montreal 22
Sellia 22
Simeri 22
Brno 21
Poplar 21
Shanghai 21
Johannesburg 20
Vibo Valentia 20
Zaccanopoli 20
Chennai 19
Bagnara Calabra 18
London 18
Santa Caterina Albanese 18
Ankara 17
Frankfurt am Main 17
Amsterdam 16
Barcelona 16
Capo Rizzuto 16
Chicago 16
Corigliano Calabro 16
Mexico City 16
Padova 16
Stockholm 16
Taurianova 16
Cagliari 15
Messina 15
Rome 15
Belo Horizonte 14
Gerace 14
Gioiosa Jonica 14
Totale 11.489
Salva come PNG Salva come JPEG
Nome #
The INFN–FBK “Phase-2” R&D program 5.722
Simulation and test of 3D silicon radiation detectors 316
3D detectors at ITC-irst: first irradiation studies 189
3D-FBK pixel sensors: Recent beam tests results with irradiated devices 188
An improved all-p-type multiguard termination structure for silicon radiation detectors 187
3D stc sensors with different strip isolation schemes and substrate materials 170
3D silicon strip detectors 165
32-Channel Detection Unit for Combined XRF-XRD in Mining Transportable Applications 160
Characterization of 3D-DDTC detectors on p-type substrates 149
Characterization and TCAD modelling of termination structures for silicon radiation detectors 148
Micromachined Silicon Radiation Sensors – Part 1: Design And Experimental Characterization 146
Development of a new generation of 3D pixel sensors for HL-LHC 146
Recent results from the development of silicon detectors with integrated electronics 146
Characterization and TCAD modelling of all-p-type termination structures for silicon radiation detectors 145
Fabrication and characterization of n-on-n silicon pixel detectors compatible with the Medipix2 readout chip 142
3D trenched-electrode sensors for charged particle tracking and timing 141
An improved all-p-type multiguard termination structure for silicon radiation detectors. 138
Micromachined Silicon Radiation Sensors – Part 2: Fabrication Technologies 138
Development of 3D detectors at FBK-irst 138
Characterization of 3D-stc detectors fabricated at ITC-irst 137
First electrical characterization of 3D detectors with electrodes of the same doping type 136
A study for the detection of ionizing particles with phototransistors on thick high-resistivity silicon substrates 134
Recent results from the development of silicon detectors with integrated electronics 134
Charge collection measurements in single-type column 3D sensors 131
An improved termination structure for silicon radiation detectors with all-p-type multiguard and cut-line implants 127
32-Channel silicon strip detection module for combined X-ray fluorescence spectroscopy and X-ray diffractometry analysis 126
Characterization and modelling of signal dynamics in 3D-DDTC detectors 126
New Deep Reactive Ion Etching process for through wafer via manufacturing 124
Hybrid Detectors of Neutrons Based on 3D Silicon Sensors with Polysiloxanes Converter 124
Beam Test Measurements with 3D-DDTC Silicon Strip Detectors on n-type Substrate 123
Silicon Buried Channels for Pixel Detector Cooling 122
Fabrication of 3D detectors with columnar electrodes of the same doping type 121
Development of radiation tolerant semiconductor detectors for the Super-LHC 120
Silicon Buried Channels for Pixel Detector Cooling 120
Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers 120
Tappered walls via holes manufactured using DRIE variable isotropy process 118
Beam Test Results of Thin n-in-p 3D and Planar Pixel Sensors for the High Luminosity LHC Tracker Upgrade at CMS 116
Simulations and Electrical Characterization of Double-side Double Type Column 3D Detectors 115
Variable isotropy Deep RIE process for through wafer via holes manufacturing 115
Characterization of BJT-based particle detectors 115
Recent advancements in the development of radiation hard semiconductor detectors for S-LHC 114
Tapered walls via holes manufactured using DRIE variable isotropy process 112
Development of 3D-DDTC pixel detectors for the ATLAS upgrade 110
Characterization of 3D and planar Si diodes with different neutron converter materials 110
V-shape through wafer via manufactured by drie variable isotropy process 109
Tapered walls via holes manufactured using DRIE variable isotropy process 109
Active-edge FBK-INFN-LPNHE thin n-on-p pixel sensors for the upgrade of the ATLAS Inner Tracker 109
R&D for new silicon pixel sensors for the High Luminosity phase of the CMS experiment at LHC 109
Development of 3D detectors featuring columnar electrodes of the same doping type 108
Laser characterisation of a 3D single-type column p-type prototype module read out with ATLAS SCT electronics 108
Hybrid Detectors for Neutrons Combining Phenyl-Polysiloxanes with 3D Silicon Detectors 108
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 108
Position Sensitive TCT Evaluation of Irradiated 3D-stc Detectors 107
PFM2: a 32 × 32 processor for X-ray diffraction imaging at FELs 106
Efficiency measurements for 3D silicon strip detectors 105
Development of new 3D pixel sensors for phase 2 upgrades at LHC 105
Advances in 3D Sensor Technology by Using Stepper Lithography 105
Double-Sided, Double-Type-Column 3-D Detectors: Design, Fabrication, and Technology Evaluation 104
Small pitch 3D devices 104
Review of R&D activities on silicon particle detectors at ITC-irst 103
Novel 3D silicon sensors for neutron detection 103
Development of radiation hard silicon detectors: the SMART project 102
Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection 102
Development of 3D trenched-electrode pixel sensors with improved timing performance 102
First production of new thin 3D sensors for HL-LHC at FBK 101
Analysis of the Radiation Hardness and Charge Collection Efficiency of Thinned Silicon Diodes 101
High-gain phototransistors on high-resistivity silicon substrate 100
INFN-FBK developments of 3D sensors for High-Luminosity LHC 100
Radiation hardness of high resistivity n- and p-type magnetic Czochralski silicon 99
Thin and edgeless sensors for ATLAS pixel detector upgrade 99
Functional Characterization of 3D-DDTC Detectors Fabricated at FBK-irst 98
Electro-optical measurements of 3D-stc detectors fabricated at ITC-irst 97
Measurements of 3D Silicon Strip Sensors by Two Manufacturers 96
Development of LGAD sensors with a thin entrance window for soft X-ray detection 95
Study of the internal quantum efficiency of FBK sensors with optimized entrance windows 95
Fabrication of novel MEMS microgrippers by deep reactive ion etching with metal hard mask 95
Radiation-hard semiconductor detectors for SuperLHC 94
Processing and first characterization of detectors made with high resistivity n- and p-type Czochralski silicon 93
Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade 90
Performance of thin planar n-on-p silicon pixels after HL-LHC radiation fluences 90
Initial results from 3D-DDTC detectors on p-type substrates 89
Radiation Hardness and Charge Collection Efficiency of Lithium Irradiated Thin Silicon Diodes 89
Investigation of 3D Silicon Microstrip Detectors for the sLHC 89
Laser and beta source setup characterization of 3D-DDTC detectors fabricated at FBK-irst 89
Silicon Detectors for the sLHC 89
Radiation resistant innovative 3D pixel sensors for the CMS upgrade at the High Luminosity LHC 89
The SMART detectors: development of radiation hard silicon devices for SLHC 87
First experimental results on active and slim-edge silicon sensors for XFEL 87
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015 neq/cm2 86
High-performance PIN photodiodes on TMAH thinned silicon wafers 85
New insights on boiling carbon dioxide flow in mini- and micro-channels for optimal silicon detector cooling 85
Study of the signal formation in single-type column 3D silicon detectors 84
Development of thin edgeless silicon pixel sensors on epitaxial wafers 84
Development and production of advanced 3D pixel sensors at FBK 83
Characterization of micro-strip detectors made with high resistivity n- and p-type Czochralski silicon 82
Silicon microstrip detectors in 3D technology for the sLHC 82
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade 82
Test beam measurements with 3D silicon strip detectors 81
Fabrication of PIN diode detectors on thinned silicon wafers 80
Design and First Characterization of Active and Slim-Edge Planar Detectors for FEL Applications 80
Totale 17.085
Salva come PNG Salva come JPEG
Categoria #
all - tutte 75.065
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 75.065
Salva come PNG Salva come JPEG


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/2021635 0 0 0 0 0 24 152 18 17 192 50 182
2021/2022645 24 33 21 73 48 12 15 102 45 21 102 149
2022/20231.674 49 129 37 315 106 266 22 111 413 153 52 21
2023/20241.145 116 70 116 31 65 127 53 161 50 150 21 185
2024/20254.077 51 118 506 70 273 64 133 219 1.313 460 525 345
2025/20263.024 342 554 722 824 457 125 0 0 0 0 0 0
Totale 18.875