IRIS Institutional Research Information System

Bagolini, Alvise
 Distribuzione geografica
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Continente #
NA - Nord America 3.432
EU - Europa 3.392
AS - Asia 1.994
SA - Sud America 340
Continente sconosciuto - Info sul continente non disponibili 28
AF - Africa 22
OC - Oceania 4
Totale 9.212
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Nazione #
US - Stati Uniti d'America 3.378
RU - Federazione Russa 1.294
HK - Hong Kong 659
SG - Singapore 642
DE - Germania 484
IT - Italia 406
CN - Cina 329
UA - Ucraina 310
BR - Brasile 309
FI - Finlandia 211
SE - Svezia 202
VN - Vietnam 130
IE - Irlanda 129
NL - Olanda 106
GB - Regno Unito 101
IN - India 89
CA - Canada 43
BE - Belgio 36
FR - Francia 31
EU - Europa 25
CZ - Repubblica Ceca 22
IR - Iran 22
IL - Israele 19
KR - Corea 17
JP - Giappone 14
AR - Argentina 12
ES - Italia 11
IQ - Iraq 11
TR - Turchia 11
LT - Lituania 10
BD - Bangladesh 9
CO - Colombia 9
MA - Marocco 9
TW - Taiwan 8
AT - Austria 7
MX - Messico 6
CH - Svizzera 5
GR - Grecia 5
PT - Portogallo 5
RS - Serbia 5
UZ - Uzbekistan 5
AU - Australia 4
EC - Ecuador 4
LB - Libano 4
SA - Arabia Saudita 4
TH - Thailandia 4
AE - Emirati Arabi Uniti 3
AZ - Azerbaigian 3
EG - Egitto 3
HU - Ungheria 3
PL - Polonia 3
ZA - Sudafrica 3
AL - Albania 2
BZ - Belize 2
MY - Malesia 2
NG - Nigeria 2
OM - Oman 2
PE - Perù 2
PY - Paraguay 2
TN - Tunisia 2
XK - ???statistics.table.value.countryCode.XK??? 2
A1 - Anonimo 1
CR - Costa Rica 1
EE - Estonia 1
GA - Gabon 1
GE - Georgia 1
HN - Honduras 1
IS - Islanda 1
JM - Giamaica 1
KE - Kenya 1
KG - Kirghizistan 1
MD - Moldavia 1
NO - Norvegia 1
NP - Nepal 1
PH - Filippine 1
PK - Pakistan 1
PS - Palestinian Territory 1
SN - Senegal 1
SY - Repubblica araba siriana 1
UY - Uruguay 1
VE - Venezuela 1
Totale 9.212
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Città #
Hong Kong 657
Jacksonville 638
Chandler 603
Moscow 372
Singapore 314
Trento 183
Boardman 179
Ashburn 167
Wilmington 158
Dong Ket 129
The Dalles 129
Dublin 127
Helsinki 127
Hefei 118
Kronberg 100
Beijing 94
Ann Arbor 76
Dearborn 76
Brooklyn 69
Munich 50
New York 50
Santa Clara 49
Woodbridge 43
Brussels 34
Seattle 32
Los Angeles 29
Pune 29
Phoenix 28
Rome 26
Redwood City 25
Houston 24
Toronto 24
Mountain View 20
Falkenstein 18
London 18
São Paulo 17
Verona 17
Brno 16
Shanghai 16
Guangzhou 15
Rio de Janeiro 15
Secaucus 15
Turku 15
San Francisco 14
Ardabil 11
Belo Horizonte 11
Monmouth Junction 11
Norwalk 11
Nuremberg 10
Amsterdam 9
Falls Church 9
Hanover 9
Milan 9
Ottawa 9
Redmond 9
Wuhan 9
Assago 8
Taipei 8
Tokyo 8
Frankfurt am Main 7
Hamirpur 7
Istanbul 7
Portland 7
Porto Alegre 7
Baghdad 6
Bari 6
Bologna 6
Dallas 6
Fortaleza 6
Gif-sur-yvette 6
Nanjing 6
Portsmouth 6
Saint Petersburg 6
Blacksburg 5
Cologne 5
New Delhi 5
Tashkent 5
Vienna 5
Barcelona 4
Betim 4
Brasília 4
Charlotte 4
Florence 4
Fremont 4
Furtwangen 4
Leawood 4
Manchester 4
Olomouc 4
Padova 4
Tappahannock 4
Auburn Hills 3
Augsburg 3
Baku 3
Bathinda 3
Belgrade 3
Blumenau 3
Bolzano 3
Buenos Aires 3
Campinas 3
Cavallino-Treporti 3
Totale 5.288
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Nome #
Oscillations During Flow Boiling in Single Microchannels 287
<100> bar corner compensation for CMOS compatible anisotropic TMAH etching 225
A single metal layer MEMS self-assembling coplanar structure 211
Performance of active edge pixel sensors 182
<110> square corner compensation and etch flow mechanism for anisotropic TMAH etching 159
Development of MEMS MOS gas sensors with CMOS compatible PECVD inter-metal passivation 158
Cr/Ni/Au multilayer films for high temperature MEMS applications 148
Analytical model for magnified displacement stress test structures. 137
Wafer-level thin film micropackaging for MEMS devices 130
Impact of the layout on the electrical characteristics of double-sided silicon 3D sensors fabricated at FBK 128
3D-FBK pixel sensors: Recent beam tests results with irradiated devices 128
Development of Modified 3D Detectors at FBK 124
Progettazione, disegno, fabbricazione e caratterizzazione di un microfono capacitivo in silicio con tecnologie MEMS 118
Micromachined Silicon Radiation Sensors – Part 1: Design And Experimental Characterization 115
Anemometric air flow sensor on Silicon membrane 111
Microcantilevers in MEMS Technology for Biosensing Applications 111
Characterization of oscillations during flow boiling of water in parallel microchannels 110
Design and testing of an innovative slim-edge termination for silicon radiation detectors 106
Socketmaster: Integrated Sensors System for the Optimised Design of Prosthetic Socket for above Knee Amputees 106
Development of Active and Slim Edge Terminations for 3D and Planar Detectors 102
Micromachined Silicon Radiation Sensors – Part 2: Fabrication Technologies 102
Stress Characterization of Silicon Oxide, Silicon Nitride, Chromium and Gold Films for Micromechanics 101
Anisotropic etching rates in TMAH solutions of different Si crystallographic orientation as a function of film stress 100
Prototype ATLAS IBL modules using the FE-I4A front-end readout chip 100
Correlation between silicon-nitride film stress and composition: XPS and SIMS analyses 100
Optimization of double side 3D detector technology for first productions at FBK 99
Stress Characterization of Silicon Oxide, Silicon Nitride, Chromium and Gold Films for Micromechanics 98
Development of planar detectors with active edge 95
Design strategies of opto-mechanical micro oscillators for the detection of the ponderomotive squeezing 95
A micromachined inertial accelerometer for avionics 94
Optimization of a Low-Power Chemoresistive Gas Sensor: Predictive Thermal Modelling and Mechanical Failure Analysis 94
In situ measurement of wood stress during drying process 93
Wideband mechanical response of high-Q silicon Double Paddle Oscillator 92
Functional characterization of planar sensors with active edges using laser and X-ray beam scans 92
Development of Double-Sided Full-Passing-Column 3D Sensors at FBK 92
Wafer-level micropackaging in thin film technology for RF MEMS applications 89
PECVD silicon-rich nitride and low stress nitride films mechanical characterization using membrane point load deflection 88
Development of a MEMS accellerometer for automobile pollution control: an approach. 86
Seismic Velocity Sensor With an Internal Sky-Hook Damping Feedback Loop 86
Stress characterization of electroplated gold layers for low temperature surface micromachining 86
Micromachined flow sensor on silicon membrane 85
Layout and Process Improvements to Double-Sided Silicon 3D Detectors Fabricated at FBK 85
Novel stress test structures for surface micromachining applications 84
Characterization of Oscillations during Flow Boiling of Water in Parallel Microchannels 84
Slim edges in double-sided silicon 3D detectors 83
Selected results from the static characterization of edgeless n-on-p planar pixel sensors for ATLAS upgrades 83
STRESS-STRAIN BEHAVIOUR OF ELECTROPLATED GOLD THIN FILMS 82
Stiffness Characterization of Biological Tissues by Means of MEMS-Technology Based Micro Grippers Under Position Control 81
Fabrication of a piston-type condenser microphone with structured polysilicon diaphragm 80
FEM based design and simulation of bulk-micromachined MEMS accelerometers with low cross axis sensitivity 79
Influence of interfaces’ density and thermal processes on mechanical stress of PECVD silicon nitride 79
Wafer-level thin film micropackaging for RF MEMS applications 79
P1MM.5 - Optimization of Silicon and Quartz MEMS Microheater for Chemoresistive Gas Sensors 79
Dynamical back-action effects in low loss optomechanical oscillators 78
Optimization of Silicon and Quartz MEMS Microheater for Chemoresistive Gas Sensors 78
Nano and micro structured targets to modulate the spatial profile of laser driven proton beams 77
Study of Bulk Micromachining Corner COmpensation with Electrochemical Anisotropic Etching 76
Design and simulation of a MEMS device to investigate the strain engineering properties of 2D nanomaterials 76
Stress and resistivity analysis of electrodeposited gold films for MEMS application 75
Experimental study and analysis of corner compensation structures for CMOS compatible bulk micromachining using 25wt% TMAH 75
Acknowledgment to Reviewers of Membranes in 2020 75
Novel silicon n-on-p edgeless planar pixel sensors for the ATLAS upgrade 74
Fabrication of low loss MOMS resonators for quantum optics experiments 74
Scalloping and Stress Concentration in DRIE-Manufactured Comb-Drives 74
RF-MEMS Monolithic K and Ka Band Multi-State Phase Shifters as Building Blocks for 5G and Internet of Things (IoT) Applications 74
Approximate Mechanical Properties of Clamped–Clamped Perforated Membranes From In-Situ Deflection Measurements Using a Stylus Profiler 74
Performance of Irradiated Thin Edgeless N-on-P Planar Pixel Sensors for ATLAS Upgrades 73
Design of silicon micro‐resonators with low mechanical and optical losses for quantum optics experiments 73
Fabrication of novel MEMS microgrippers by deep reactive ion etching with metal hard mask 73
Initial results from new 3D neutron detectors 72
Electrical characterization of thin edgeless N-on-p planar pixel sensors for ATLAS upgrades 72
Nanolithography on Silicon by FIB using Au and Ge as ion beam species 71
Evidence of plasmon resonance of nickel particles deposited by pulsed laser ablation 71
Novel Test structures for stress diagnosis in micromechanics 70
Silicon Deep Reactive Ion Etching with aluminum hard mask 67
In situ measurement of wood stress during drying process 66
Design and Validation of a Single-SOI-Wafer 4-DOF Crawling Microgripper 65
PECVD Low Stress Silicon Nitride Analysis and Optimization for the Fabrication of CMUT Devices 63
On the Optimization of a MEMS Device for Chemoresistive Gas Sensors 63
Tailoring design and fabrication of capacitive RF MEMS switches for K-band applications 62
Fast multi-parametric method for mechanical properties estimation of clamped—clamped perforated membranes 62
Development of edgeless silicon pixel sensors on p-type substrate for the ATLAS high-luminosity Upgrade 61
Design and Finite Element Analysis of an Electrothermally Actuated Microgripper for Biomedical Applications 60
Development of edgeless n-on-p planar pixel sensors for future ATLAS upgrades 59
Low-temperature thin film encapsulation for MEMS with silicon nitride/chromium cap 56
Performance of edgeless silicon pixel sensors on p-type substrate for the ATLAS high-luminosity upgrade 56
Manipulation of laser-accelerated proton beam profiles by nanostructured and microstructured targets 56
Load-Deflection Behavior of RF-MEMS Switches: FEA and Analytical Modeling for Prediction of Mechanical Properties 56
High Frequency MEMS Capacitive Mirror for Space Applications 55
Influence of design and fabrication on RF performance of capacitive RF MEMS switches 55
Thin and edgeless sensors for ATLAS pixel detector upgrade 55
Optimization of the efficiency and reliability of reverse-fabricated CMUT arrays 55
Influence of Etching Potential on Convex Corner Anisotropic Etching in TMAH Solution 53
New MEMS Tweezers for the Viscoelastic Characterization of Soft Materials at the Microscale 52
Development of Edgeless Silicon Pixel Sensors on p-type substrate for the ATLAS High-Luminosity Upgrade 51
Single Condensation Droplet Self-Ejection from Divergent Structures with Uniform Wettability 47
A C-shaped hinge for displacement magnification in MEMS rotational structures 46
Performance Analysis of a CSFH-Based Microgripper: Analytical Modeling and Simulation 46
Innovative Silicon Microgrippers for Biomedical Applications: Design, Mechanical Simulation and Evaluation of Protein Fouling 46
Mechanical Response of Four-Bar Linkage Microgrippers with Bidirectional Electrostatic Actuation 46
Totale 8.855
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Categoria #
all - tutte 52.339
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 52.339
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202027 0 0 0 0 0 0 0 0 0 0 0 27
2020/2021876 112 8 98 44 97 37 126 20 3 138 28 165
2021/2022651 32 55 7 94 25 10 22 98 42 33 123 110
2022/20231.307 49 107 30 199 67 174 41 121 325 127 38 29
2023/20241.119 120 42 96 45 62 138 46 123 38 222 22 165
2024/20253.887 42 75 359 71 408 173 102 193 1.332 397 584 151
Totale 9.411