Sfoglia per Autore
MEMS Technology for RF Passive Components
2011-01-01 Iannacci, Jacopo; Faes, Alessandro; Margesin, Benno
Modeling and characterization of a circular-shaped energy scavenger in MEMS surface micromachining technology
2011-01-01 Solazzi, Francesco; Iannacci, Jacopo; Faes, Alessandro; Giacomozzi, Flavio; Margesin, Benno; A., Tazzoli; G., Meneghesso
Design and characterization of an active recovering mechanism for high-performance RF MEMS redundancy switches
2011-01-01 Solazzi, Francesco; A., Tazzoli; P., Farinelli; Faes, Alessandro; Mulloni, Viviana; Margesin, Benno; G., Meneghesso
A Flexible Fabrication Process for RF MEMS Devices
2011-01-01 Giacomozzi, Flavio; Mulloni, Viviana; Colpo, Sabrina; Iannacci, Jacopo; Margesin, Benno; Faes, Alessandro
Modeling of gold microbeams for characterizing MEMS packages
2011-01-01 Faes, Alessandro; A., Repchankova; Solazzi, Francesco; Margesin, Benno
A Flexible Technology Platform for the Fabrication of RF-MEMS Devices
2011-01-01 Giacomozzi, Flavio; Mulloni, Viviana; Colpo, Sabrina; Iannacci, Jacopo; Margesin, Benno; Faes, Alessandro
An active heat-based restoring mechanism for improving the reliability of RF-MEMS switches
2011-01-01 Iannacci, Jacopo; Faes, Alessandro; A., Repchankova; A., Tazzoli; G., Meneghesso
Modeling of gold microbeams as strain and pressure sensors for characterizing MEMS packages
2012-01-01 Faes, Alessandro; Resta, Giuseppe; Solazzi, Francesco; Margesin, Benno
RF-MEMS chip capping by dry film epoxy polymer
2012-01-01 Giacomozzi, Flavio; Colpo, Sabrina; Faes, Alessandro; Sordo, Guido; Girardi, Stefano; P., Farinelli
A simple analytical method for residual stress measurement on suspended MEM structures using surface profilometry
2013-01-01 Mulloni, Viviana; Colpo, Sabrina; Faes, Alessandro; Margesin, Benno
Wet release technology for bulk-silicon resonators fabrication on silicon-on-insulator substrate
2013-01-01 Mulloni, Viviana; Faes, Alessandro; Margesin, Benno
Characterization of quartz-based package for RF MEMS
2013-01-01 Sordo, Guido; Faes, Alessandro; Resta, Giuseppe; Iannacci, Jacopo
RF-MEMS devices packaging by using quartz caps and epoxy polymer sealing rings
2013-01-01 Giacomozzi, Flavio; Mulloni, Viviana; Colpo, Sabrina; Faes, Alessandro; Sordo, Guido; Girardi, Stefano
RF-MEMS chip capping by dry film epoxy polymer
2013-01-01 Giacomozzi, Flavio; Colpo, Sabrina; Faes, Alessandro; Sordo, Guido; Girardi, Stefano; Farinelli, P.
RF-MEMS packaging by using quartz caps and epoxy polymers
2014-01-01 Giacomozzi, Flavio; Mulloni, Viviana; Colpo, Sabrina; Faes, Alessandro; Sordo, Guido; Girardi, Stefano
Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects
2014-01-01 Cherman, Vladimir O.; Pham, Nga P.; Slabbekoorn, John; Faes, Alessandro; Margesin, Benno; Tilmans, Harrie A. C.
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| MEMS Technology for RF Passive Components | 1-gen-2011 | Iannacci, Jacopo; Faes, Alessandro; Margesin, Benno | |
| Modeling and characterization of a circular-shaped energy scavenger in MEMS surface micromachining technology | 1-gen-2011 | Solazzi, Francesco; Iannacci, Jacopo; Faes, Alessandro; Giacomozzi, Flavio; Margesin, Benno; A., Tazzoli; G., Meneghesso | |
| Design and characterization of an active recovering mechanism for high-performance RF MEMS redundancy switches | 1-gen-2011 | Solazzi, Francesco; A., Tazzoli; P., Farinelli; Faes, Alessandro; Mulloni, Viviana; Margesin, Benno; G., Meneghesso | |
| A Flexible Fabrication Process for RF MEMS Devices | 1-gen-2011 | Giacomozzi, Flavio; Mulloni, Viviana; Colpo, Sabrina; Iannacci, Jacopo; Margesin, Benno; Faes, Alessandro | |
| Modeling of gold microbeams for characterizing MEMS packages | 1-gen-2011 | Faes, Alessandro; A., Repchankova; Solazzi, Francesco; Margesin, Benno | |
| A Flexible Technology Platform for the Fabrication of RF-MEMS Devices | 1-gen-2011 | Giacomozzi, Flavio; Mulloni, Viviana; Colpo, Sabrina; Iannacci, Jacopo; Margesin, Benno; Faes, Alessandro | |
| An active heat-based restoring mechanism for improving the reliability of RF-MEMS switches | 1-gen-2011 | Iannacci, Jacopo; Faes, Alessandro; A., Repchankova; A., Tazzoli; G., Meneghesso | |
| Modeling of gold microbeams as strain and pressure sensors for characterizing MEMS packages | 1-gen-2012 | Faes, Alessandro; Resta, Giuseppe; Solazzi, Francesco; Margesin, Benno | |
| RF-MEMS chip capping by dry film epoxy polymer | 1-gen-2012 | Giacomozzi, Flavio; Colpo, Sabrina; Faes, Alessandro; Sordo, Guido; Girardi, Stefano; P., Farinelli | |
| A simple analytical method for residual stress measurement on suspended MEM structures using surface profilometry | 1-gen-2013 | Mulloni, Viviana; Colpo, Sabrina; Faes, Alessandro; Margesin, Benno | |
| Wet release technology for bulk-silicon resonators fabrication on silicon-on-insulator substrate | 1-gen-2013 | Mulloni, Viviana; Faes, Alessandro; Margesin, Benno | |
| Characterization of quartz-based package for RF MEMS | 1-gen-2013 | Sordo, Guido; Faes, Alessandro; Resta, Giuseppe; Iannacci, Jacopo | |
| RF-MEMS devices packaging by using quartz caps and epoxy polymer sealing rings | 1-gen-2013 | Giacomozzi, Flavio; Mulloni, Viviana; Colpo, Sabrina; Faes, Alessandro; Sordo, Guido; Girardi, Stefano | |
| RF-MEMS chip capping by dry film epoxy polymer | 1-gen-2013 | Giacomozzi, Flavio; Colpo, Sabrina; Faes, Alessandro; Sordo, Guido; Girardi, Stefano; Farinelli, P. | |
| RF-MEMS packaging by using quartz caps and epoxy polymers | 1-gen-2014 | Giacomozzi, Flavio; Mulloni, Viviana; Colpo, Sabrina; Faes, Alessandro; Sordo, Guido; Girardi, Stefano | |
| Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects | 1-gen-2014 | Cherman, Vladimir O.; Pham, Nga P.; Slabbekoorn, John; Faes, Alessandro; Margesin, Benno; Tilmans, Harrie A. C. |
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