This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both cap-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic switches is reported indicating no loss of functionality but a modification of actuation voltage induced by the thermal treatment.

RF-MEMS chip capping by dry film epoxy polymer

Giacomozzi, Flavio;Colpo, Sabrina;Faes, Alessandro;Sordo, Guido;Girardi, Stefano;
2013

Abstract

This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both cap-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic switches is reported indicating no loss of functionality but a modification of actuation voltage induced by the thermal treatment.
File in questo prodotto:
Non ci sono file associati a questo prodotto.

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11582/202419
 Attenzione

Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo

Citazioni
  • ???jsp.display-item.citation.pmc??? ND
social impact