Characterization of quartz-based package for RF MEMS

In the last decade Micro-Electro-Mechanical Systems (MEMS) technology experienced a significant development in various fields of Information and Communication Technology (ICT). In particular MEMS for Radio Frequency (RF) applications have emerged as a remarkable solution in order to fabricate components with outstanding performances. The encapsulation of such devices is a relevant aspect to be addressed in order to enable wide exploitation of RF-MEMS technology in commercial applications. A MEMS package must not only protect fragile mechanical parts but also provide the interface to the next level of the packaging hierarchy in a cost effective technology. Additionally, in RF applications the electromagnetic impact of the package has to be carefully considered. Given such a scenario, the focus of this work is the characterization of a chip capping solution for RF-MEMS devices. Such solution uses a quartz cap having an epoxy-based dry film sealing ring. Relevant issues affecting RF-MEMS devices once packaged, e.g. the mechanical strain induced by the cap and the hermeticity of the sealing ring, are worth investigating. This work focuses on the study of induced strain, as a function of different bonding parameters. Dimensional features of the sealing ring (i.e. the width), and process parameters, like temperature and pressure, have been considered. The package characterization is performed by using basic test vehicles, such as strain gauges, designed to be integrated inside the internal cavity of the package itself. Polysilicon piezoresistors are used as strain gauges, whereas aluminum resistors are used as thermometers to assess the impact of temperature changes on strain measurements. Experimental data are reported including calibration of the sensors as well as environmental measurements with and without cap. In addition measurements of the shear stress of the proposed packaging solution are also reported.