IRIS Institutional Research Information System

Nawaz, Ali
 Distribuzione geografica
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Continente #
EU - Europa 1.844
NA - Nord America 999
AS - Asia 850
SA - Sud America 303
AF - Africa 31
Continente sconosciuto - Info sul continente non disponibili 1
Totale 4.028
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Nazione #
RU - Federazione Russa 1.180
US - Stati Uniti d'America 942
BR - Brasile 267
SG - Singapore 258
CN - Cina 227
IT - Italia 214
DE - Germania 122
VN - Vietnam 112
HK - Hong Kong 102
FI - Finlandia 63
FR - Francia 55
NL - Olanda 50
SE - Svezia 41
CA - Canada 31
IN - India 31
GB - Regno Unito 19
IE - Irlanda 19
MX - Messico 19
PL - Polonia 19
AR - Argentina 18
BD - Bangladesh 17
JP - Giappone 17
BE - Belgio 13
ES - Italia 13
TR - Turchia 11
KR - Corea 10
ZA - Sudafrica 10
CH - Svizzera 9
TW - Taiwan 9
IQ - Iraq 8
IL - Israele 7
PK - Pakistan 7
ID - Indonesia 6
MA - Marocco 6
CO - Colombia 5
EC - Ecuador 5
KE - Kenya 5
LT - Lituania 5
UA - Ucraina 5
UZ - Uzbekistan 5
EG - Egitto 4
CL - Cile 3
KZ - Kazakistan 3
MD - Moldavia 3
SA - Arabia Saudita 3
TN - Tunisia 3
AT - Austria 2
AZ - Azerbaigian 2
BG - Bulgaria 2
CZ - Repubblica Ceca 2
JO - Giordania 2
NP - Nepal 2
PH - Filippine 2
PT - Portogallo 2
PY - Paraguay 2
VE - Venezuela 2
AE - Emirati Arabi Uniti 1
AL - Albania 1
AO - Angola 1
BW - Botswana 1
DK - Danimarca 1
DM - Dominica 1
DO - Repubblica Dominicana 1
EE - Estonia 1
GR - Grecia 1
IR - Iran 1
JM - Giamaica 1
KG - Kirghizistan 1
LB - Libano 1
MN - Mongolia 1
MY - Malesia 1
NI - Nicaragua 1
OM - Oman 1
PA - Panama 1
PE - Perù 1
RO - Romania 1
RS - Serbia 1
SN - Senegal 1
SV - El Salvador 1
SY - Repubblica araba siriana 1
TH - Thailandia 1
TT - Trinidad e Tobago 1
XK - ???statistics.table.value.countryCode.XK??? 1
Totale 4.028
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Città #
San Jose 158
Singapore 137
Hong Kong 100
Ashburn 91
Beijing 77
Moscow 73
Trento 66
Dallas 56
Boardman 52
Chandler 52
Helsinki 47
The Dalles 39
Ho Chi Minh City 38
Hanoi 33
Munich 30
Hefei 28
Lauterbourg 25
New York 25
Kronberg 24
Los Angeles 24
Brooklyn 23
Santa Clara 22
São Paulo 21
Shanghai 20
Dublin 19
Warsaw 16
Bologna 15
Turku 15
Pergine Valsugana 14
Tokyo 14
Verona 14
Brussels 13
Milan 13
Falkenstein 12
Wilmington 12
Orem 11
Rio de Janeiro 11
Montreal 10
Chennai 8
Denver 8
Frankfurt am Main 8
Mexico City 8
Raleigh 8
Atlanta 7
St Petersburg 7
Taipei 7
Baghdad 6
Brasília 6
Dhaka 6
Geneva 6
Latina 6
London 6
Phoenix 6
Rovereto 6
Toronto 6
Amsterdam 5
Barcelona 5
Columbus 5
Council Bluffs 5
Houston 5
Nuremberg 5
Stockholm 5
Turin 5
Aracaju 4
Belo Horizonte 4
Campinas 4
Chemnitz 4
Chicago 4
Da Nang 4
Haiphong 4
Hillsboro 4
Johannesburg 4
Naples 4
Paris 4
Poplar 4
Pune 4
San Francisco 4
Tashkent 4
Ankara 3
Ann Arbor 3
Aparecida de Goiânia 3
Bari 3
Bellaterra 3
Bergamo 3
Biên Hòa 3
Boston 3
Calgary 3
Curitiba 3
Fortaleza 3
Juiz de Fora 3
Lakewood 3
Londrina 3
Maastricht 3
Marnaz 3
Mumbai 3
Nairobi 3
Ninh Bình 3
Nova Iguaçu 3
Porto Alegre 3
Querétaro 3
Totale 1.731
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Nome #
3D integration technologies for custom SiPM: From BSI to TSV interconnections 269
Silicon Photomultipliers technologies for 3D integration 250
3D integration approaches for Silicon Photomultipliers: from backside-illuminated to Through Silicon Via interconnections 191
Multi-cycle Chamber Conditioning for Plasma Etching of SiO2: From Optimization to Stability in Lot Processing 179
Impact of Planar and Vertical Organic Field‐Effect Transistors on Flexible Electronics 156
Investigations on the Physical Properties of CdCl2 Heat-Treated ITO/CDTE/CDS Thin Films Solar Cell 152
Advanced Neuromorphic Applications Enabled by Synaptic Ion-Gating Vertical Transistors 142
Gate dielectric surface treatments for performance improvement of poly(3-hexylthiophene-2,5-diyl) based organic field-effect transistors 141
High mobility organic field-effect transistors based on defect-free regioregular poly(3-hexylthiophene-2,5-diyl) 140
Freestanding Membrane Element 138
Organic Electrochemical Transistors for In Vivo Bioelectronics 138
Edge-driven nanomembrane-based vertical organic transistors showing a multi-sensing capability 136
Biodegradable Materials for Transient Organic Transistors 134
Reorganization Energy upon Controlled Intermolecular Charge-Transfer Reactions in Monolithically Integrated Nanodevices 132
Improvement of poly(3-hexylthiophene-2,5-diyl) electron mobility through complete elimination of regioregularity defects 132
Experimental and modeling study of low-voltage field-effect transistors fabricated with molecularly aligned copolymer floating films 130
Comparative Study of Cadmium Sulfide Thin Films at Room and Low Temperatures Fabricated by Closed Space Sublimation Technique 129
Biomass‐Derived Materials for Interface Engineering in Organic/Perovskite Photovoltaic and Light‐Emitting Devices 127
Organic field-effect transistor-based flexible sensors 124
Poly(vinyl alcohol) gate dielectric surface treatment with vitamin C for poly(3-hexylthiophene-2,5-diyl) based field effect transistors performance improvement 117
Polymer-dielectric molecular interactions in defect-free poly(3-hexylthiophene): dependence and consequences of regioregularity on transistor charge transport properties 117
Poly(vinyl alcohol) gate dielectric in organic field-effect transistors 114
Biodegradable Materials for Transient Organic Transistors 113
Modification of the charge transport properties of the copper phthalocyanine/poly(vinyl alcohol) interface using cationic or anionic surfactant for field-effect transistor performance enhancement 111
Poly(Vinyl Alcohol) Gate Dielectric Treated With Anionic Surfactant in C60 Fullerene-Based n-Channel Organic Field Effect Transistors 110
Ultra-high mobility in defect-free poly(3-hexylthiophene-2,5-diyl) field-effect transistors through supra-molecular alignment 105
Performance enhancement of poly(3-hexylthiophene-2,5-diyl) based field effect transistors through surfactant treatment of the poly(vinyl alcohol) gate insulator surface 105
Pushing On-Chip Photosensitivity Forward Using Edge-Driven Vertical Organic Phototransistors 93
Fabrication technologies of back-side illuminated SiPM for VUV/NUV light detection at Fondazione Bruno Kessler 87
Reliable fabrication of buried microchannels via polymer trench passivation 66
Developments of glass-less TSV interconnections for SiPM at FBK 35
Totale 4.113
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Categoria #
all - tutte 16.920
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 16.920
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022121 16 3 20 25 0 0 1 25 12 2 15 2
2022/2023229 2 25 20 20 1 3 7 25 58 41 9 18
2023/2024384 40 7 31 18 29 21 23 47 7 49 23 89
2024/20251.049 22 31 129 42 31 34 34 55 345 102 141 83
2025/20262.330 112 134 164 237 115 109 230 948 176 105 0 0
Totale 4.113