Vasilache, Dan Adrian
 Distribuzione geografica
Continente #
NA - Nord America 762
EU - Europa 603
AS - Asia 155
SA - Sud America 33
Continente sconosciuto - Info sul continente non disponibili 7
Totale 1.560
Nazione #
US - Stati Uniti d'America 757
RU - Federazione Russa 207
SE - Svezia 84
DE - Germania 82
UA - Ucraina 57
SG - Singapore 55
FI - Finlandia 50
HK - Hong Kong 37
CN - Cina 29
BR - Brasile 28
IE - Irlanda 27
NL - Olanda 22
BE - Belgio 20
IT - Italia 19
VN - Vietnam 18
CZ - Repubblica Ceca 12
GB - Regno Unito 10
EU - Europa 7
IN - India 5
CA - Canada 4
FR - Francia 4
PL - Polonia 4
TR - Turchia 3
UZ - Uzbekistan 3
AR - Argentina 2
BO - Bolivia 2
IR - Iran 2
PT - Portogallo 2
CH - Svizzera 1
HR - Croazia 1
JM - Giamaica 1
JO - Giordania 1
JP - Giappone 1
KG - Kirghizistan 1
LT - Lituania 1
PE - Perù 1
Totale 1.560
Città #
Chandler 170
Jacksonville 124
Ann Arbor 61
Moscow 58
Ashburn 38
Hong Kong 37
New York 36
Helsinki 33
Wilmington 33
Dublin 27
Boardman 26
Singapore 23
The Dalles 21
Brussels 20
Dong Ket 18
Shanghai 18
Woodbridge 18
Brooklyn 17
Kronberg 16
Dearborn 15
Brno 11
Phoenix 9
Santa Clara 8
Beijing 7
Trento 7
Falkenstein 6
Hanover 6
Los Angeles 6
Seattle 5
Miami 4
Munich 4
Redmond 4
São Paulo 4
Toronto 4
Mountain View 3
Pune 3
Saint Petersburg 3
Tashkent 3
Gunzenhausen 2
La Paz 2
Radomsko 2
Redwood City 2
Rome 2
Tappahannock 2
Zanjan 2
Absecon 1
Albignasego 1
Amman 1
Amsterdam 1
Andradina 1
Aparecida de Goiânia 1
Belo Horizonte 1
Bishkek 1
Brasília 1
Campo Grande 1
Campos dos Goytacazes 1
Capinzal 1
Caxias 1
Cidade Dutra 1
Cologne 1
Delhi 1
Des Moines 1
El Talar 1
Engenheiro Coelho 1
Ferrara 1
Florence 1
Garanhuns 1
Guangzhou 1
Guatapará 1
Hefei 1
Istanbul 1
Itápolis 1
Joinville 1
Jundiaí 1
Kingston 1
Leawood 1
Lima 1
Lincoln 1
Magnesia ad Sipylum 1
Monmouth Junction 1
Mysiadło 1
Nanchang 1
North Bergen 1
Nuremberg 1
Osasco 1
Parma 1
Prague 1
Reston 1
Rio de Janeiro 1
San Jose 1
Sanayi 1
Santana do Seridó 1
Santo André 1
Senigallia 1
Serra Talhada 1
St Petersburg 1
São Gotardo 1
São Luís 1
Tokyo 1
Viamão 1
Totale 975
Nome #
Conductive through silicon via holes for RF applications 130
Wafer resistivity influence over DRIE processes for TSVs manufacturing 119
OPTIMIZED DRIE PROCESS FOR TAPERED WALLS THROUGH WAFER VIA HOLES MANUFACTURING 105
BRIDGE TYPE AND CANTILEVER TYPE MEMS SWITCH STRUCTURES 98
Fabrication of Through-Wafer Interconnections by Gold Electroplating 98
Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer 97
STUDY OF AN ELECTRO-MECHANIC MECHANISM EXPLOITING IN-PLANE ROTATION FOR THE REALIZATION OF TUNEABLE CAPACITORS 91
New Deep Reactive Ion Etching process for through wafer via manufacturing 90
Tappered walls via holes manufactured using DRIE variable isotropy process 90
Design and Optimization of Microwave Lumped Elements Fllters using mixed Circuital-Electromagnetic Simulations 88
Tapered walls via holes manufactured using DRIE variable isotropy process 85
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 82
Tapered walls via holes manufactured using DRIE variable isotropy process 81
null 77
null 76
MEMS Switch for 60 GHz Band 74
Compact lumped elements micromachined band-pass filters with discrete switching for 1.8/5.2 GHz applications 69
Variable isotropy Deep RIE process for through wafer via holes manufacturing 12
V-shape through wafer via manufactured by drie variable isotropy process 11
Totale 1.573
Categoria #
all - tutte 8.472
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 8.472


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202030 0 0 0 0 0 0 0 0 0 0 17 13
2020/2021194 27 0 18 16 17 8 26 2 0 34 12 34
2021/2022117 6 1 0 29 2 0 5 13 3 7 33 18
2022/2023313 15 37 6 63 17 49 11 17 62 21 11 4
2023/2024211 22 9 25 10 11 52 13 22 1 28 3 15
2024/2025432 14 3 38 11 7 30 26 55 185 57 6 0
Totale 1.573