statistiche ricercatore

Continente	#
NA - Nord America	678
EU - Europa	345
AS - Asia	81
Continente sconosciuto - Info sul continente non disponibili	7
SA - Sud America	2
Totale	1.113

Nome	#
Conductive through silicon via holes for RF applications	99
Wafer resistivity influence over DRIE processes for TSVs manufacturing	88
OPTIMIZED DRIE PROCESS FOR TAPERED WALLS THROUGH WAFER VIA HOLES MANUFACTURING	77
Fabrication of Through-Wafer Interconnections by Gold Electroplating	72
Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer	71
BRIDGE TYPE AND CANTILEVER TYPE MEMS SWITCH STRUCTURES	68
New Deep Reactive Ion Etching process for through wafer via manufacturing	68
V-shape through wafer via manufactured by drie variable isotropy process	67
STUDY OF AN ELECTRO-MECHANIC MECHANISM EXPLOITING IN-PLANE ROTATION FOR THE REALIZATION OF TUNEABLE CAPACITORS	67
Tappered walls via holes manufactured using DRIE variable isotropy process	60
Tapered walls via holes manufactured using DRIE variable isotropy process	60
Variable isotropy Deep RIE process for through wafer via holes manufacturing	59
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications	58
Design and Optimization of Microwave Lumped Elements Fllters using mixed Circuital-Electromagnetic Simulations	57
Tapered walls via holes manufactured using DRIE variable isotropy process	55
MEMS Switch for 60 GHz Band	53
Compact lumped elements micromachined band-pass filters with discrete switching for 1.8/5.2 GHz applications	44
Totale	1.123

	Totale	Lug	Ago	Sett	Ott	Nov	Dic	Gen	Feb	Mar	Apr	Mag	Giu
2018/2019	4	0	0	0	0	0	0	0	0	0	0	3	1
2019/2020	157	20	17	2	3	23	9	22	4	20	7	17	13
2020/2021	194	27	0	18	16	17	8	26	2	0	34	12	34
2021/2022	117	6	1	0	29	2	0	5	13	3	7	33	18
2022/2023	313	15	37	6	63	17	49	11	17	62	21	11	4
2023/2024	193	22	9	25	10	11	52	13	22	1	28	0	0
Totale													1.123

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