Vasilache, Dan Adrian
 Distribuzione geografica
Continente #
NA - Nord America 719
EU - Europa 386
AS - Asia 117
Continente sconosciuto - Info sul continente non disponibili 7
SA - Sud America 5
Totale 1.234
Nazione #
US - Stati Uniti d'America 718
SE - Svezia 84
DE - Germania 76
UA - Ucraina 57
FI - Finlandia 45
HK - Hong Kong 37
CN - Cina 28
RU - Federazione Russa 28
IE - Irlanda 26
SG - Singapore 23
BE - Belgio 19
VN - Vietnam 18
IT - Italia 13
CZ - Repubblica Ceca 12
GB - Regno Unito 10
EU - Europa 7
IN - India 5
FR - Francia 4
NL - Olanda 4
PL - Polonia 4
BO - Bolivia 2
IR - Iran 2
PT - Portogallo 2
AR - Argentina 1
BR - Brasile 1
CA - Canada 1
CH - Svizzera 1
HR - Croazia 1
JP - Giappone 1
KG - Kirghizistan 1
PE - Perù 1
TR - Turchia 1
UZ - Uzbekistan 1
Totale 1.234
Città #
Chandler 170
Jacksonville 124
Ann Arbor 61
Hong Kong 37
Ashburn 36
New York 36
Wilmington 33
Helsinki 28
Boardman 26
Dublin 26
Brussels 19
Dong Ket 18
Singapore 18
Woodbridge 18
Brooklyn 17
Shanghai 17
Kronberg 16
Dearborn 15
Moscow 15
Brno 11
Phoenix 9
Beijing 7
Hanover 6
Los Angeles 6
Trento 6
Santa Clara 5
Seattle 5
Miami 4
Munich 4
Redmond 4
Mountain View 3
Pune 3
Saint Petersburg 3
Gunzenhausen 2
La Paz 2
Radomsko 2
Redwood City 2
Tappahannock 2
Zanjan 2
Absecon 1
Albignasego 1
Bishkek 1
Cologne 1
Delhi 1
Des Moines 1
Falkenstein 1
Ferrara 1
Florence 1
Guangzhou 1
Hefei 1
Leawood 1
Lima 1
Lincoln 1
Monmouth Junction 1
Mysiadło 1
Nanchang 1
North Bergen 1
Nuremberg 1
Prague 1
Reston 1
San Jose 1
Sanayi 1
Senigallia 1
St Petersburg 1
São Luís 1
Tashkent 1
Tokyo 1
Toronto 1
Villigen 1
Warsaw 1
Zagreb 1
Totale 850
Nome #
Conductive through silicon via holes for RF applications 106
Wafer resistivity influence over DRIE processes for TSVs manufacturing 95
OPTIMIZED DRIE PROCESS FOR TAPERED WALLS THROUGH WAFER VIA HOLES MANUFACTURING 84
Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer 78
BRIDGE TYPE AND CANTILEVER TYPE MEMS SWITCH STRUCTURES 76
STUDY OF AN ELECTRO-MECHANIC MECHANISM EXPLOITING IN-PLANE ROTATION FOR THE REALIZATION OF TUNEABLE CAPACITORS 76
Fabrication of Through-Wafer Interconnections by Gold Electroplating 76
Variable isotropy Deep RIE process for through wafer via holes manufacturing 74
V-shape through wafer via manufactured by drie variable isotropy process 73
New Deep Reactive Ion Etching process for through wafer via manufacturing 73
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 67
Tappered walls via holes manufactured using DRIE variable isotropy process 66
Design and Optimization of Microwave Lumped Elements Fllters using mixed Circuital-Electromagnetic Simulations 66
Tapered walls via holes manufactured using DRIE variable isotropy process 64
Tapered walls via holes manufactured using DRIE variable isotropy process 61
MEMS Switch for 60 GHz Band 60
Compact lumped elements micromachined band-pass filters with discrete switching for 1.8/5.2 GHz applications 49
Totale 1.244
Categoria #
all - tutte 6.823
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 6.823


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202092 0 0 0 0 0 9 22 4 20 7 17 13
2020/2021194 27 0 18 16 17 8 26 2 0 34 12 34
2021/2022117 6 1 0 29 2 0 5 13 3 7 33 18
2022/2023313 15 37 6 63 17 49 11 17 62 21 11 4
2023/2024211 22 9 25 10 11 52 13 22 1 28 3 15
2024/2025103 14 3 38 11 7 30 0 0 0 0 0 0
Totale 1.244