Vasilache, Dan Adrian
 Distribuzione geografica
Continente #
NA - Nord America 775
EU - Europa 588
AS - Asia 162
SA - Sud America 44
Continente sconosciuto - Info sul continente non disponibili 7
AF - Africa 1
Totale 1.577
Nazione #
US - Stati Uniti d'America 766
RU - Federazione Russa 189
DE - Germania 84
SE - Svezia 84
SG - Singapore 57
UA - Ucraina 57
FI - Finlandia 50
HK - Hong Kong 41
BR - Brasile 39
CN - Cina 29
IE - Irlanda 27
BE - Belgio 20
NL - Olanda 20
IT - Italia 18
VN - Vietnam 18
CZ - Repubblica Ceca 13
GB - Regno Unito 12
EU - Europa 7
CA - Canada 6
IN - India 6
PL - Polonia 5
FR - Francia 4
TR - Turchia 3
UZ - Uzbekistan 3
AR - Argentina 2
BO - Bolivia 2
IR - Iran 2
JM - Giamaica 2
PT - Portogallo 2
CH - Svizzera 1
HR - Croazia 1
JO - Giordania 1
JP - Giappone 1
KG - Kirghizistan 1
LT - Lituania 1
MA - Marocco 1
MX - Messico 1
PE - Perù 1
Totale 1.577
Città #
Chandler 170
Jacksonville 124
Ann Arbor 61
Moscow 55
Hong Kong 41
Ashburn 39
New York 36
Helsinki 33
Wilmington 33
Dublin 27
Boardman 26
Singapore 25
The Dalles 21
Brussels 20
Dong Ket 18
Shanghai 18
Woodbridge 18
Brooklyn 17
Kronberg 16
Dearborn 15
Brno 11
Phoenix 9
Santa Clara 8
Beijing 7
Los Angeles 7
Trento 7
Falkenstein 6
Hanover 6
Munich 6
Toronto 6
Seattle 5
São Paulo 5
Miami 4
Redmond 4
Mountain View 3
Pune 3
Saint Petersburg 3
Tashkent 3
Gunzenhausen 2
Kingston 2
La Paz 2
Manchester 2
Radomsko 2
Redwood City 2
Rome 2
Tappahannock 2
Warsaw 2
Zanjan 2
Absecon 1
Albignasego 1
Amman 1
Amsterdam 1
Andradina 1
Aparecida de Goiânia 1
Barbacena 1
Bebedouro 1
Belgorod 1
Belo Horizonte 1
Bishkek 1
Botucatu 1
Brasília 1
Campinas 1
Campo Grande 1
Campos dos Goytacazes 1
Capinzal 1
Casablanca 1
Caxias 1
Chennai 1
Cidade Dutra 1
Clarksburg 1
Cologne 1
Delhi 1
Des Moines 1
El Talar 1
Engenheiro Coelho 1
Ferrara 1
Florence 1
Garanhuns 1
Guangzhou 1
Guatapará 1
Hefei 1
Istanbul 1
Itabira 1
Ituaçu 1
Itápolis 1
Jaguariaíva 1
Jandira 1
Joinville 1
Jundiaí 1
Leawood 1
Lima 1
Lincoln 1
Magnesia ad Sipylum 1
Mexico City 1
Monmouth Junction 1
Mysiadło 1
Nanchang 1
North Bergen 1
Nuremberg 1
Olomouc 1
Totale 988
Nome #
Conductive through silicon via holes for RF applications 133
Wafer resistivity influence over DRIE processes for TSVs manufacturing 121
OPTIMIZED DRIE PROCESS FOR TAPERED WALLS THROUGH WAFER VIA HOLES MANUFACTURING 106
Fabrication of Through-Wafer Interconnections by Gold Electroplating 102
BRIDGE TYPE AND CANTILEVER TYPE MEMS SWITCH STRUCTURES 99
Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer 99
STUDY OF AN ELECTRO-MECHANIC MECHANISM EXPLOITING IN-PLANE ROTATION FOR THE REALIZATION OF TUNEABLE CAPACITORS 95
New Deep Reactive Ion Etching process for through wafer via manufacturing 93
Tappered walls via holes manufactured using DRIE variable isotropy process 92
Design and Optimization of Microwave Lumped Elements Fllters using mixed Circuital-Electromagnetic Simulations 89
Tapered walls via holes manufactured using DRIE variable isotropy process 88
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 87
Tapered walls via holes manufactured using DRIE variable isotropy process 82
Variable isotropy Deep RIE process for through wafer via holes manufacturing 80
V-shape through wafer via manufactured by drie variable isotropy process 79
MEMS Switch for 60 GHz Band 78
Compact lumped elements micromachined band-pass filters with discrete switching for 1.8/5.2 GHz applications 71
Totale 1.594
Categoria #
all - tutte 8.558
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 8.558


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202030 0 0 0 0 0 0 0 0 0 0 17 13
2020/2021194 27 0 18 16 17 8 26 2 0 34 12 34
2021/2022117 6 1 0 29 2 0 5 13 3 7 33 18
2022/2023313 15 37 6 63 17 49 11 17 62 21 11 4
2023/2024211 22 9 25 10 11 52 13 22 1 28 3 15
2024/2025453 14 3 38 11 7 30 26 54 165 55 50 0
Totale 1.594