Vasilache, Dan Adrian

Vasilache, Dan Adrian  

Mostra records
Risultati 1 - 17 di 17 (tempo di esecuzione: 0.016 secondi).
Titolo Data di pubblicazione Autore(i) File
BRIDGE TYPE AND CANTILEVER TYPE MEMS SWITCH STRUCTURES 1-gen-2010 Vasilache, Dan Adrian; G., Boldeiu; V., Moagar; C., Tibeica
Compact lumped elements micromachined band-pass filters with discrete switching for 1.8/5.2 GHz applications 1-gen-2006 D., Neculoiu; Giacomozzi, Flavio; L., Bary; Vasilache, Dan Adrian; A. A., Muller; Margesin, Benno; I., Petrini; C., Buiculescu; A., Takacs; R., Plana; A., Muller
Conductive through silicon via holes for RF applications 1-gen-2012 Vasilache, Dan Adrian; Colpo, Sabrina; Chistè, Matteo; Giacomozzi, Flavio; Margesin, Benno
Design and Optimization of Microwave Lumped Elements Fllters using mixed Circuital-Electromagnetic Simulations 1-gen-2008 D., Neculoiu; Andrei, Muller; Giacomozzi, Flavio; Vasilache, Dan Adrian; Petrini, Ioana Elena; C., Buiculescu; A., Muller
Fabrication of Through-Wafer Interconnections by Gold Electroplating 1-gen-2011 Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Margesin, Benno; Chistè, Matteo
MEMS Switch for 60 GHz Band 1-gen-2010 Vasilache, Dan Adrian; G., Constantinidis; M., Dragoman; A., Takacs; F., Vladoianu; T., Kostopoulos; G., Boldeiu; V., Moagar; C., Tibeica; L., Bary; R., Plana
New Deep Reactive Ion Etching process for through wafer via manufacturing 1-gen-2010 Vasilache, Dan Adrian; Colpo, Sabrina; Ronchin, Sabina; Giacomozzi, Flavio; Margesin, Benno
OPTIMIZED DRIE PROCESS FOR TAPERED WALLS THROUGH WAFER VIA HOLES MANUFACTURING 1-gen-2012 Vasilache, Dan Adrian; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Chistè, Matteo; P., Schiopu
STUDY OF AN ELECTRO-MECHANIC MECHANISM EXPLOITING IN-PLANE ROTATION FOR THE REALIZATION OF TUNEABLE CAPACITORS 1-gen-2010 P. T., Savadkoohi; Margesin, Benno; Vasilache, Dan Adrian; Giacomozzi, Flavio
Tapered walls via holes manufactured using DRIE variable isotropy process 1-gen-2011 Vasilache, Dan Adrian; Resta, Giuseppe; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore
Tapered walls via holes manufactured using DRIE variable isotropy process 1-gen-2012 Vasilache, Dan Adrian; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore
Tappered walls via holes manufactured using DRIE variable isotropy process 1-gen-2012 Vasilache, Dan Adrian; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore
Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer 1-gen-2012 Qureshi, Abdul Qader Ahsan; Colpo, Sabrina; Vasilache, Dan Adrian; Girardi, Stefano; Conci, Paolo; Margesin, Benno
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications 1-gen-2012 Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Gennaro, Salvatore; Qureshi, Abdul Qader Ahsan; Margesin, Benno
V-shape through wafer via manufactured by drie variable isotropy process 1-gen-2010 Vasilache, Dan Adrian; Colpo, Sabrina; Ronchin, Sabina; Giacomozzi, Flavio; Margesin, Benno
Variable isotropy Deep RIE process for through wafer via holes manufacturing 1-gen-2011 Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Qureshi, Abdul Qader Ahsan; Margesin, Benno
Wafer resistivity influence over DRIE processes for TSVs manufacturing 1-gen-2012 Vasilache, Dan Adrian; Chistè, Matteo; Colpo, Sabrina; Giacomozzi, Flavio; Margesin, Benno