Vasilache, Dan Adrian
Vasilache, Dan Adrian
MEMS
BRIDGE TYPE AND CANTILEVER TYPE MEMS SWITCH STRUCTURES
2010-01-01 Vasilache, Dan Adrian; G., Boldeiu; V., Moagar; C., Tibeica
Compact lumped elements micromachined band-pass filters with discrete switching for 1.8/5.2 GHz applications
2006-01-01 D., Neculoiu; Giacomozzi, Flavio; L., Bary; Vasilache, Dan Adrian; A. A., Muller; Margesin, Benno; I., Petrini; C., Buiculescu; A., Takacs; R., Plana; A., Muller
Conductive through silicon via holes for RF applications
2012-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Chistè, Matteo; Giacomozzi, Flavio; Margesin, Benno
Design and Optimization of Microwave Lumped Elements Fllters using mixed Circuital-Electromagnetic Simulations
2008-01-01 D., Neculoiu; Andrei, Muller; Giacomozzi, Flavio; Vasilache, Dan Adrian; Petrini, Ioana Elena; C., Buiculescu; A., Muller
Fabrication of Through-Wafer Interconnections by Gold Electroplating
2011-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Margesin, Benno; Chistè, Matteo
MEMS Switch for 60 GHz Band
2010-01-01 Vasilache, Dan Adrian; G., Constantinidis; M., Dragoman; A., Takacs; F., Vladoianu; T., Kostopoulos; G., Boldeiu; V., Moagar; C., Tibeica; L., Bary; R., Plana
New Deep Reactive Ion Etching process for through wafer via manufacturing
2010-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Ronchin, Sabina; Giacomozzi, Flavio; Margesin, Benno
OPTIMIZED DRIE PROCESS FOR TAPERED WALLS THROUGH WAFER VIA HOLES MANUFACTURING
2012-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Chistè, Matteo; P., Schiopu
STUDY OF AN ELECTRO-MECHANIC MECHANISM EXPLOITING IN-PLANE ROTATION FOR THE REALIZATION OF TUNEABLE CAPACITORS
2010-01-01 P. T., Savadkoohi; Margesin, Benno; Vasilache, Dan Adrian; Giacomozzi, Flavio
Tapered walls via holes manufactured using DRIE variable isotropy process
2011-01-01 Vasilache, Dan Adrian; Resta, Giuseppe; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore
Tapered walls via holes manufactured using DRIE variable isotropy process
2012-01-01 Vasilache, Dan Adrian; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore
Tappered walls via holes manufactured using DRIE variable isotropy process
2012-01-01 Vasilache, Dan Adrian; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore
Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer
2012-01-01 Qureshi, Abdul Qader Ahsan; Colpo, Sabrina; Vasilache, Dan Adrian; Girardi, Stefano; Conci, Paolo; Margesin, Benno
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications
2012-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Gennaro, Salvatore; Qureshi, Abdul Qader Ahsan; Margesin, Benno
V-shape through wafer via manufactured by drie variable isotropy process
2010-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Ronchin, Sabina; Giacomozzi, Flavio; Margesin, Benno
Variable isotropy Deep RIE process for through wafer via holes manufacturing
2011-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Qureshi, Abdul Qader Ahsan; Margesin, Benno
Wafer resistivity influence over DRIE processes for TSVs manufacturing
2012-01-01 Vasilache, Dan Adrian; Chistè, Matteo; Colpo, Sabrina; Giacomozzi, Flavio; Margesin, Benno
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| BRIDGE TYPE AND CANTILEVER TYPE MEMS SWITCH STRUCTURES | 1-gen-2010 | Vasilache, Dan Adrian; G., Boldeiu; V., Moagar; C., Tibeica | |
| Compact lumped elements micromachined band-pass filters with discrete switching for 1.8/5.2 GHz applications | 1-gen-2006 | D., Neculoiu; Giacomozzi, Flavio; L., Bary; Vasilache, Dan Adrian; A. A., Muller; Margesin, Benno; I., Petrini; C., Buiculescu; A., Takacs; R., Plana; A., Muller | |
| Conductive through silicon via holes for RF applications | 1-gen-2012 | Vasilache, Dan Adrian; Colpo, Sabrina; Chistè, Matteo; Giacomozzi, Flavio; Margesin, Benno | |
| Design and Optimization of Microwave Lumped Elements Fllters using mixed Circuital-Electromagnetic Simulations | 1-gen-2008 | D., Neculoiu; Andrei, Muller; Giacomozzi, Flavio; Vasilache, Dan Adrian; Petrini, Ioana Elena; C., Buiculescu; A., Muller | |
| Fabrication of Through-Wafer Interconnections by Gold Electroplating | 1-gen-2011 | Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Margesin, Benno; Chistè, Matteo | |
| MEMS Switch for 60 GHz Band | 1-gen-2010 | Vasilache, Dan Adrian; G., Constantinidis; M., Dragoman; A., Takacs; F., Vladoianu; T., Kostopoulos; G., Boldeiu; V., Moagar; C., Tibeica; L., Bary; R., Plana | |
| New Deep Reactive Ion Etching process for through wafer via manufacturing | 1-gen-2010 | Vasilache, Dan Adrian; Colpo, Sabrina; Ronchin, Sabina; Giacomozzi, Flavio; Margesin, Benno | |
| OPTIMIZED DRIE PROCESS FOR TAPERED WALLS THROUGH WAFER VIA HOLES MANUFACTURING | 1-gen-2012 | Vasilache, Dan Adrian; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Chistè, Matteo; P., Schiopu | |
| STUDY OF AN ELECTRO-MECHANIC MECHANISM EXPLOITING IN-PLANE ROTATION FOR THE REALIZATION OF TUNEABLE CAPACITORS | 1-gen-2010 | P. T., Savadkoohi; Margesin, Benno; Vasilache, Dan Adrian; Giacomozzi, Flavio | |
| Tapered walls via holes manufactured using DRIE variable isotropy process | 1-gen-2011 | Vasilache, Dan Adrian; Resta, Giuseppe; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore | |
| Tapered walls via holes manufactured using DRIE variable isotropy process | 1-gen-2012 | Vasilache, Dan Adrian; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore | |
| Tappered walls via holes manufactured using DRIE variable isotropy process | 1-gen-2012 | Vasilache, Dan Adrian; Ronchin, Sabina; Colpo, Sabrina; Margesin, Benno; Giacomozzi, Flavio; Gennaro, Salvatore | |
| Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer | 1-gen-2012 | Qureshi, Abdul Qader Ahsan; Colpo, Sabrina; Vasilache, Dan Adrian; Girardi, Stefano; Conci, Paolo; Margesin, Benno | |
| Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications | 1-gen-2012 | Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Gennaro, Salvatore; Qureshi, Abdul Qader Ahsan; Margesin, Benno | |
| V-shape through wafer via manufactured by drie variable isotropy process | 1-gen-2010 | Vasilache, Dan Adrian; Colpo, Sabrina; Ronchin, Sabina; Giacomozzi, Flavio; Margesin, Benno | |
| Variable isotropy Deep RIE process for through wafer via holes manufacturing | 1-gen-2011 | Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Qureshi, Abdul Qader Ahsan; Margesin, Benno | |
| Wafer resistivity influence over DRIE processes for TSVs manufacturing | 1-gen-2012 | Vasilache, Dan Adrian; Chistè, Matteo; Colpo, Sabrina; Giacomozzi, Flavio; Margesin, Benno |