On-chip direct coupling of dielectric waveguides to Si substrate-integrated photodetectors has been realized within a top-down approach. A first-run 44% external quantum efficiency at 850 nm is shown for an oxynitride photonic integrated circuit at room temperature.

Top-down convergence of near-infrared photonics with silicon substrate-integrated electronics

Bernard, Martino
;
Acerbi, Fabio;Paternoster, Giovanni;Piccoli, Gioele;Gola, Alberto;Pucker, Georg;Pancheri, Lucio;Ghulinyan, Mher
2021-01-01

Abstract

On-chip direct coupling of dielectric waveguides to Si substrate-integrated photodetectors has been realized within a top-down approach. A first-run 44% external quantum efficiency at 850 nm is shown for an oxynitride photonic integrated circuit at room temperature.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11582/329228
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