This paper deals with the manipulation of micro-objects operated by a new concept multi-hinge multi-DoF (degree of freedom) microsystem. The system is composed of a planar 3-DoF microstage and of a set of one-DoF microgrippers, and it is arranged is such a way as to allow any microgripper to crawl over the stage. As a result, the optimal configuration to grasp the micro-object can be reached. Classical algorithms of kinematic analysis have been used to study the rigid-body model of the mobile platform. Then, the rigid-body replacement method has been implemented to design the corresponding compliant mechanism, whose geometry can be transferred onto the etch mask. Deep-reactive ion etching (DRIE) is suggested to fabricate the whole system. The main contributions of this investigation consist of (i) the achievement of a relative motion between the supporting platform and the microgrippers, and of (ii) the design of a process flow for the simultaneous fabrication of the stage and the microgrippers, starting from a single silicon-on-insulator (SOI) wafer. Functionality is validated via theoretical simulation and finite element analysis, whereas fabrication feasibility is granted by preliminary tests performed on some parts of the microsystem.
Design and Validation of a Single-SOI-Wafer 4-DOF Crawling Microgripper
Alvise Bagolini;Pierluigi Bellutti;
2019-01-01
Abstract
This paper deals with the manipulation of micro-objects operated by a new concept multi-hinge multi-DoF (degree of freedom) microsystem. The system is composed of a planar 3-DoF microstage and of a set of one-DoF microgrippers, and it is arranged is such a way as to allow any microgripper to crawl over the stage. As a result, the optimal configuration to grasp the micro-object can be reached. Classical algorithms of kinematic analysis have been used to study the rigid-body model of the mobile platform. Then, the rigid-body replacement method has been implemented to design the corresponding compliant mechanism, whose geometry can be transferred onto the etch mask. Deep-reactive ion etching (DRIE) is suggested to fabricate the whole system. The main contributions of this investigation consist of (i) the achievement of a relative motion between the supporting platform and the microgrippers, and of (ii) the design of a process flow for the simultaneous fabrication of the stage and the microgrippers, starting from a single silicon-on-insulator (SOI) wafer. Functionality is validated via theoretical simulation and finite element analysis, whereas fabrication feasibility is granted by preliminary tests performed on some parts of the microsystem.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
