‘Stretchable electronics’ refers to highly deformable devices in which compliant polymeric substrates support micron-size sensor units; these may provide spatially distributed measurements over complex surfaces. Stretchable sensors have opened new perspectives and applications in many fields, among which biomedicine is one of the most promising: instrumentation for tools which need to withstand significant bending or stretching during service has been demonstrated via balloon catheters and implantable patches, enabling a totally new generation of smart devices. Stretchability and bendability of such systems are achieved by selecting a compliant substrate for the sensing units and by granting sufficient deformability to the electrical interconnects. The results of this study provided an insight into the local mechanics involved in the onset of the delamination and buckling in S-shape deformable interconnects. In particular, a correlation was found between the interface failure phenomena and the geometrical parameters that define the design of deformable interconnects, allowing the identification of unexpected drawbacks related to specific S-shape design features.

Buckling waves in aluminum on a polyimide sea: In situ analysis towards a reliable design strategy for stretchable electronics

Lorenzelli, Leandro;
2015-01-01

Abstract

‘Stretchable electronics’ refers to highly deformable devices in which compliant polymeric substrates support micron-size sensor units; these may provide spatially distributed measurements over complex surfaces. Stretchable sensors have opened new perspectives and applications in many fields, among which biomedicine is one of the most promising: instrumentation for tools which need to withstand significant bending or stretching during service has been demonstrated via balloon catheters and implantable patches, enabling a totally new generation of smart devices. Stretchability and bendability of such systems are achieved by selecting a compliant substrate for the sensing units and by granting sufficient deformability to the electrical interconnects. The results of this study provided an insight into the local mechanics involved in the onset of the delamination and buckling in S-shape deformable interconnects. In particular, a correlation was found between the interface failure phenomena and the geometrical parameters that define the design of deformable interconnects, allowing the identification of unexpected drawbacks related to specific S-shape design features.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11582/300846
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