In this paper, circuital and planar electromagnetic simulations have been performed to model the microwave response of micromachined lumped elements by using commercial software packages. The modelling has been performed on realized and experimentally tested coplanar lumped elements and filters. The technology is based on micromachining of high resistivity silicon wafers and GaAs, and the circuits were obtained on trilayer dielectric membranes and polymide membranes
Micromachined coplanar microwave components: technology and modelling
Giacomozzi, Flavio;
2001-01-01
Abstract
In this paper, circuital and planar electromagnetic simulations have been performed to model the microwave response of micromachined lumped elements by using commercial software packages. The modelling has been performed on realized and experimentally tested coplanar lumped elements and filters. The technology is based on micromachining of high resistivity silicon wafers and GaAs, and the circuits were obtained on trilayer dielectric membranes and polymide membranesFile in questo prodotto:
Non ci sono file associati a questo prodotto.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.