In this paper, we present a verification method to compare the hardware and etch performance of different Oxford Instruments dry etching systems to facilitate etch recipe transfer. The flow-pressure window and the chemical and physical flux within the same flow-pressure window were determined for each system. The chemical and physical fluxes were matched between the investigated systems to yield similar etch results. The method was tested using a continuous SF6/O2 silicon etching recipe.
A Method for Comparing Dry Etch Equipment
Ronchin, Sabina;
2024-01-01
Abstract
In this paper, we present a verification method to compare the hardware and etch performance of different Oxford Instruments dry etching systems to facilitate etch recipe transfer. The flow-pressure window and the chemical and physical flux within the same flow-pressure window were determined for each system. The chemical and physical fluxes were matched between the investigated systems to yield similar etch results. The method was tested using a continuous SF6/O2 silicon etching recipe.File in questo prodotto:
Non ci sono file associati a questo prodotto.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
