Tape Automated Bonding of an ALPIDE Chip with Flexible PCBs

In advancing high-energy physics and astroparticle research, there is a need for packaging solution that accommodate cutting-edge particle detectors with minimal measurement interference, especially for 4D-tracking applications. These platforms should be flexible and have a low material budget to accomodate complex goemetries and support multiple detection planes. This work presents a prototype of the latest advancements of the reaserch carried on at Foundation Bruno Kessler: a hybrid assembly which combines a state-of-the-art monolithic active pixel sensor (MAPS, ALPIDE) with a flexible package for power supply and signal transmission. The package is made of aluminum and polymide to optimize material budget. The fabrication process, made utilizing wet etching and reactive ion etching, is discussed in the first section. The bonding procedure, achieved through spTAB (Single Point Tape Automated Bonding), and the preliminary results of the first characterization are described in the second section. TAB bonding offers several advantages, including high interconnection density, good reliability and planar integration, making it ideal for integrating advanced particle detectors into compact, flexible platforms.