The project aimed at developing and optimizing a technological step in particular the Electrodeposition (ECD) process of Sn and Ag alloy that is be considered a key process in the WLP technologies. The project was hosted by the IMB-CNM, Instituto de Microelectrónica de Barcelona. At the IMB-CNM, the largest public microelectronics research and development center in Spain, there are leading knowledge and competence in the field of the electrodeposition. There is a signed general agreement between FBK and IMB-CNM to expand existing contacts and ongoing scientific collaborations between the two institutions in the field of “Micro and Nano Integrated System”, and this project implemented a bilateral co-operation in developing a building block technology for microsystems.
FBK Mobility final report-Electrodeposition of SnAg solders for Wafer Level Packaging
Conci, Paolo
2013-01-01
Abstract
The project aimed at developing and optimizing a technological step in particular the Electrodeposition (ECD) process of Sn and Ag alloy that is be considered a key process in the WLP technologies. The project was hosted by the IMB-CNM, Instituto de Microelectrónica de Barcelona. At the IMB-CNM, the largest public microelectronics research and development center in Spain, there are leading knowledge and competence in the field of the electrodeposition. There is a signed general agreement between FBK and IMB-CNM to expand existing contacts and ongoing scientific collaborations between the two institutions in the field of “Micro and Nano Integrated System”, and this project implemented a bilateral co-operation in developing a building block technology for microsystems.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
