The project aimed at developing and optimizing a technological step in particular the Electrodeposition (ECD) process of Sn and Ag alloy that is be considered a key process in the WLP technologies. The project was hosted by the IMB-CNM, Instituto de Microelectrónica de Barcelona. At the IMB-CNM, the largest public microelectronics research and development center in Spain, there are leading knowledge and competence in the field of the electrodeposition. There is a signed general agreement between FBK and IMB-CNM to expand existing contacts and ongoing scientific collaborations between the two institutions in the field of “Micro and Nano Integrated System”, and this project implemented a bilateral co-operation in developing a building block technology for microsystems.

FBK Mobility final report-Electrodeposition of SnAg solders for Wafer Level Packaging

Conci, Paolo
2013

Abstract

The project aimed at developing and optimizing a technological step in particular the Electrodeposition (ECD) process of Sn and Ag alloy that is be considered a key process in the WLP technologies. The project was hosted by the IMB-CNM, Instituto de Microelectrónica de Barcelona. At the IMB-CNM, the largest public microelectronics research and development center in Spain, there are leading knowledge and competence in the field of the electrodeposition. There is a signed general agreement between FBK and IMB-CNM to expand existing contacts and ongoing scientific collaborations between the two institutions in the field of “Micro and Nano Integrated System”, and this project implemented a bilateral co-operation in developing a building block technology for microsystems.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11582/224015
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