This paper presents a CMOS smart pixel designed for scannerless, real-time, three-dimensional measurement systems, based on Indirect Time-Of-Flight technique. The proposed architecture allows for a high dynamic range which represents an essential requisite in range finding systems. A test chip consisting of two 8x8-pixel arrays, with Correlated-Double-Sampling and Double-Delta-Sampling pixel read-out for Fixed-Pattern-Noise suppression has been fabricated in a 0.35-um, 3.3-V, CMOS technology. Circuit simulations validating the design approach and the sensor performance are presented. Preliminary results from electrical test confirm the correct operation of the chip and extensive electro-optical characterization is currently underway.
A CMOS test chip for 3D vision applications with high dynamic range
Viarani, Luigi;Stoppa, David;Gonzo, Lorenzo;Gottardi, Massimo;Simoni, Andrea
2003-01-01
Abstract
This paper presents a CMOS smart pixel designed for scannerless, real-time, three-dimensional measurement systems, based on Indirect Time-Of-Flight technique. The proposed architecture allows for a high dynamic range which represents an essential requisite in range finding systems. A test chip consisting of two 8x8-pixel arrays, with Correlated-Double-Sampling and Double-Delta-Sampling pixel read-out for Fixed-Pattern-Noise suppression has been fabricated in a 0.35-um, 3.3-V, CMOS technology. Circuit simulations validating the design approach and the sensor performance are presented. Preliminary results from electrical test confirm the correct operation of the chip and extensive electro-optical characterization is currently underway.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
