This chapter discusses the use of microelectromechanical systems (MEMS) technology for the realization of next-generation microwave devices for wireless communications. This technology allows the fabrication of both improved performance lumped elements and newer tunable or reconfi gurable complex networks, adding extra functionality in modern wireless systems. After an overview, the salient technological features of lumped element components, such as ohmic and capacitive switches, as well as variable capacitors and inductors, are presented. A technological platform for the fabrication of complex networks is then illustrated in detail, together with some examples of fabricated devices.

RF MEMS technology for next-generation wireless communications

Giacomozzi, Flavio;Iannacci, Jacopo
2013

Abstract

This chapter discusses the use of microelectromechanical systems (MEMS) technology for the realization of next-generation microwave devices for wireless communications. This technology allows the fabrication of both improved performance lumped elements and newer tunable or reconfi gurable complex networks, adding extra functionality in modern wireless systems. After an overview, the salient technological features of lumped element components, such as ohmic and capacitive switches, as well as variable capacitors and inductors, are presented. A technological platform for the fabrication of complex networks is then illustrated in detail, together with some examples of fabricated devices.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11582/189211
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