This paper presents the design and test of a CMOS integrated circuit implementing a 160x120-pixels 3D camera. The on-pixel processing allows the use of Indirect Time-Of-Flight technique for distance measurement with reset noise removal through Correlated Double Sampling and embedded fixed-pattern noise reduction, while a fast readout operation allows to stream out the pixels values at a maximum rate of 10MSample/s. The imager can operate as a fast 2D camera up to 458fps, a 3D camera up to 80fps or both. The chip has been fabricated using a standard 0.18um 1P4M 1.8V CMOS technology with MIM capacitors. The resulting pixel has a pitch of 29.1um with a fill-factor of 34% and consists of 66 transistors. Distance measurements up to 4.5m have been performed with pulsed laser light, achieving 2.5cm precision at 2m in real-time
A 160x120-Pixels Range Camera with On-Pixel Correlated Double Sampling and Nonuniformity Correction in 29.1um pitch
Perenzoni, Matteo;Massari, Nicola;Stoppa, David;Pancheri, Lucio;Malfatti, Mattia;Gonzo, Lorenzo
2010-01-01
Abstract
This paper presents the design and test of a CMOS integrated circuit implementing a 160x120-pixels 3D camera. The on-pixel processing allows the use of Indirect Time-Of-Flight technique for distance measurement with reset noise removal through Correlated Double Sampling and embedded fixed-pattern noise reduction, while a fast readout operation allows to stream out the pixels values at a maximum rate of 10MSample/s. The imager can operate as a fast 2D camera up to 458fps, a 3D camera up to 80fps or both. The chip has been fabricated using a standard 0.18um 1P4M 1.8V CMOS technology with MIM capacitors. The resulting pixel has a pitch of 29.1um with a fill-factor of 34% and consists of 66 transistors. Distance measurements up to 4.5m have been performed with pulsed laser light, achieving 2.5cm precision at 2m in real-timeI documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
