A monolithic multispectral detector for imaging in the visible (VIS), infrared (IR) and terahertz (THz) ranges has been designed for operation at room temperature. This sensor is composed of a CMOS readout integrated circuit (ROIC) housing visible photodiodes and of IR and THz microbolometer pixels processed above the CMOS wafer. Without package- and system-level issues, targeted individual pixel sensitivities are respectively an 80dB dynamic range for VIS photodiodes, a NETD=50mK @f/1 for IR and a THz NEP smaller than 10pW. Prototyping chips will be integrated in tri-spectral imaging and THz spectroscopy demonstration systems

A Monolithic Visible, Infrared and Terahertz 2D Detector

Perenzoni, Matteo;Massari, Nicola;
2010

Abstract

A monolithic multispectral detector for imaging in the visible (VIS), infrared (IR) and terahertz (THz) ranges has been designed for operation at room temperature. This sensor is composed of a CMOS readout integrated circuit (ROIC) housing visible photodiodes and of IR and THz microbolometer pixels processed above the CMOS wafer. Without package- and system-level issues, targeted individual pixel sensitivities are respectively an 80dB dynamic range for VIS photodiodes, a NETD=50mK @f/1 for IR and a THz NEP smaller than 10pW. Prototyping chips will be integrated in tri-spectral imaging and THz spectroscopy demonstration systems
9781424466566
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11582/14549
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