Improving the reliability of electrostatically actuated RF-MEMS switches: FEM simulations and measurements on a thermal recovery mechanism

We present a detailed study on an active thermal recovery mechanism intended to counteract stiction in an electrostatically actuated RF-MEMS switch. A problemadapted, hierarchized analysis procedure based on a recently derived and presented finite element (FE) model has been applied to investigate the impact of different design and material parameters on the efficiency of this mechanism as well as on the overall operation of the device. The simulation results are discussed with respect to the device operation in case of stiction due to micro-welding or other adhesive forces and are compared to optical measurements. From the presented results guidelines are derived on how the recovery mechanism and, herewith, the reliability of the switch may be improved by design.