Short summary This work presents a novel and cost effective approach for obtaining ultra-thin chips on flexible substrates. The flex-chips are obtained by thinning down the bulk wafers and then transferring the ultra-thin membranes to the flexible polyimide foils. A key feature of the proposed method is the usage of modified transfer printing approach to transfer the large (1.5 cm x 3.5 cm) and ultra thin (∼15 µm thick) silicon membranes on the flexible foils. Another unique feature of presented method is that it can be considered as an add-on to the standard wafer based technology, meaning that the method can be adopted after fabricating the high-performance (and often complex) electronic circuitry on the bulk wafers.

Large and Ultra-thin Chips on Flexible Foils

Dahiya, Ravinder Singh;Collini, Cristian;Adami, Andrea;Lorenzelli, Leandro
2012

Abstract

Short summary This work presents a novel and cost effective approach for obtaining ultra-thin chips on flexible substrates. The flex-chips are obtained by thinning down the bulk wafers and then transferring the ultra-thin membranes to the flexible polyimide foils. A key feature of the proposed method is the usage of modified transfer printing approach to transfer the large (1.5 cm x 3.5 cm) and ultra thin (∼15 µm thick) silicon membranes on the flexible foils. Another unique feature of presented method is that it can be considered as an add-on to the standard wafer based technology, meaning that the method can be adopted after fabricating the high-performance (and often complex) electronic circuitry on the bulk wafers.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11582/112603
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