Franzoi, Alberto
Franzoi, Alberto
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3D integration approaches for Silicon Photomultipliers: from backside-illuminated to Through Silicon Via interconnections
2022-01-01 Parellada Monreal, L.; Acerbi, F.; Ficorella, A.; Franzoi, A.; Gola, A. G.; Merzi, S.; Nawaz, A.; Ruzzarin, M.; Paternoster, G.
3D integration technologies for custom SiPM: From BSI to TSV interconnections
2023-01-01 Parellada Monreal, L.; Acerbi, F.; Ficorella, A.; Franzoi, A.; Gola, A.; Merzi, S.; Nawaz, A.; Ruzzarin, M.; Paternoster, G.
Glass-free SiPMs with Through Silicon Vias for VUV/NUV light detection
2023-01-01 Parellada Monreal, Laura; Acerbi, F; Ficorella, A; Franzoi, A; Gola, A; Merzi, S; Ruzzarin, M; Zorzi, N; Paternoster, G
Silicon Photomultipliers technologies for 3D integration
2022-01-01 PARELLADA MONREAL, L.; Ferrario, L.; Acerbi, F.; Franzoi, A.; Gola, A. G.; Merzi, S.; Nawaz, A.; Ruzzarin, M.; Paternoster, G.
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| 3D integration approaches for Silicon Photomultipliers: from backside-illuminated to Through Silicon Via interconnections | 1-gen-2022 | Parellada Monreal, L.; Acerbi, F.; Ficorella, A.; Franzoi, A.; Gola, A. G.; Merzi, S.; Nawaz, A.; Ruzzarin, M.; Paternoster, G. | |
| 3D integration technologies for custom SiPM: From BSI to TSV interconnections | 1-gen-2023 | Parellada Monreal, L.; Acerbi, F.; Ficorella, A.; Franzoi, A.; Gola, A.; Merzi, S.; Nawaz, A.; Ruzzarin, M.; Paternoster, G. | |
| Glass-free SiPMs with Through Silicon Vias for VUV/NUV light detection | 1-gen-2023 | Parellada Monreal, Laura; Acerbi, F; Ficorella, A; Franzoi, A; Gola, A; Merzi, S; Ruzzarin, M; Zorzi, N; Paternoster, G | |
| Silicon Photomultipliers technologies for 3D integration | 1-gen-2022 | PARELLADA MONREAL, L.; Ferrario, L.; Acerbi, F.; Franzoi, A.; Gola, A. G.; Merzi, S.; Nawaz, A.; Ruzzarin, M.; Paternoster, G. |