To evaluate potential solutions for reducing the damage to ultra low-k dielectrics during photoresist stripping in advanced interconnect technology,we have investigated the mechanisms of interactions between remote H2, D2 and N2 discharges and porous organo-silicate materials. Extended sub-surface modifications take place in high carbon-content organo-silicates, whereas silica-rich dielectrics show negligible chemical damages during the same treatments. The nature of plasma/dielectric interactions depends primarily on the organic fraction of the ULKmaterial. Methyl groups in silica-rich organosilicates withstand the interaction with the plasma species. Conversely, large organic compounds in carbon-rich dielectrics experience cleavage reactions leading to volatile hydrocarbon formation and compositional changes. For conditions where stripping-induced damage is introduced, the effects scalewith the substrate temperature in the range 200 °C–300 °C. The permeation of the ULK material by remote plasma species depends on its porosity.

Interactions of photoresist stripping plasmas with nanoporous organo-silicate ultra low dielectric constant dielectrics

Lazzeri, Paolo;Bersani, Massimo;
2008-01-01

Abstract

To evaluate potential solutions for reducing the damage to ultra low-k dielectrics during photoresist stripping in advanced interconnect technology,we have investigated the mechanisms of interactions between remote H2, D2 and N2 discharges and porous organo-silicate materials. Extended sub-surface modifications take place in high carbon-content organo-silicates, whereas silica-rich dielectrics show negligible chemical damages during the same treatments. The nature of plasma/dielectric interactions depends primarily on the organic fraction of the ULKmaterial. Methyl groups in silica-rich organosilicates withstand the interaction with the plasma species. Conversely, large organic compounds in carbon-rich dielectrics experience cleavage reactions leading to volatile hydrocarbon formation and compositional changes. For conditions where stripping-induced damage is introduced, the effects scalewith the substrate temperature in the range 200 °C–300 °C. The permeation of the ULK material by remote plasma species depends on its porosity.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11582/4958
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