Qureshi, Abdul Qader Ahsan
Qureshi, Abdul Qader Ahsan
MEMS
3D Micromachined Ka (30 GHz) Band RF MEMS Filter for On-Board Satellite Communication Systems
2013-01-01 Qureshi, Abdul Qader Ahsan; Pelliccia, L.; Colpo, Sabrina; Giacomozzi, Flavio; Farinelli, P.; Margesin, Benno
3D Micromachined Ka (30 GHz) Band RF MEMS Filter for On-Board Satellite Communication Systems
2014-01-01 Qureshi, Abdul Qader Ahsan; Pelliccia, L.; Colpo, Sabrina; Giacomozzi, Flavio; Farinelli, P.; Margesin, Benno
Multilayer micromachined bandpass filter for L/S band satellite communication systems
2013-01-01 Qureshi, Abdul Qader Ahsan; L., Pelliccia; Colpo, Sabrina; Iannacci, Jacopo; P., Farinelli; Margesin, Benno
Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer
2012-01-01 Qureshi, Abdul Qader Ahsan; Colpo, Sabrina; Vasilache, Dan Adrian; Girardi, Stefano; Conci, Paolo; Margesin, Benno
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications
2012-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Gennaro, Salvatore; Qureshi, Abdul Qader Ahsan; Margesin, Benno
Variable isotropy Deep RIE process for through wafer via holes manufacturing
2011-01-01 Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Qureshi, Abdul Qader Ahsan; Margesin, Benno
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| 3D Micromachined Ka (30 GHz) Band RF MEMS Filter for On-Board Satellite Communication Systems | 1-gen-2013 | Qureshi, Abdul Qader Ahsan; Pelliccia, L.; Colpo, Sabrina; Giacomozzi, Flavio; Farinelli, P.; Margesin, Benno | |
| 3D Micromachined Ka (30 GHz) Band RF MEMS Filter for On-Board Satellite Communication Systems | 1-gen-2014 | Qureshi, Abdul Qader Ahsan; Pelliccia, L.; Colpo, Sabrina; Giacomozzi, Flavio; Farinelli, P.; Margesin, Benno | |
| Multilayer micromachined bandpass filter for L/S band satellite communication systems | 1-gen-2013 | Qureshi, Abdul Qader Ahsan; L., Pelliccia; Colpo, Sabrina; Iannacci, Jacopo; P., Farinelli; Margesin, Benno | |
| Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer | 1-gen-2012 | Qureshi, Abdul Qader Ahsan; Colpo, Sabrina; Vasilache, Dan Adrian; Girardi, Stefano; Conci, Paolo; Margesin, Benno | |
| Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications | 1-gen-2012 | Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Gennaro, Salvatore; Qureshi, Abdul Qader Ahsan; Margesin, Benno | |
| Variable isotropy Deep RIE process for through wafer via holes manufacturing | 1-gen-2011 | Vasilache, Dan Adrian; Colpo, Sabrina; Giacomozzi, Flavio; Ronchin, Sabina; Qureshi, Abdul Qader Ahsan; Margesin, Benno |